Chi-Ming Lin

Title: Chi-Ming Lin: Innovator in Circuit Board Technology

Introduction

Chi-Ming Lin is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of circuit board technology, holding a total of 2 patents. His innovative work focuses on enhancing the performance and reliability of electronic components.

Latest Patents

Chi-Ming Lin's latest patents include a laminate circuit board with a multi-layer circuit structure. This invention features a substrate, a first circuit metal layer, a second circuit metal layer, a first nanometer plating layer, a second nanometer plating layer, and a cover layer. The design improves junction adhesion through chemical bonding, allowing for a denser circuit without the need for roughening the circuit metal layer. Another significant patent is a method for inhibiting the growth of a nickel-copper-tin intermetallic layer in solder joints. This method utilizes a Sn-Ag-Cu solder alloy with palladium to prevent unwanted intermetallic growth at the solder joint interface, ensuring better performance at elevated temperatures.

Career Highlights

Throughout his career, Chi-Ming Lin has worked with esteemed organizations such as Yuan Ze University and Kinsus Interconnect Technology Corporation. His experience in these institutions has allowed him to develop and refine his innovative ideas in circuit technology.

Collaborations

Chi-Ming Lin has collaborated with notable colleagues, including Cheng-En Ho and Jun-Chung Hsu. Their combined expertise has contributed to advancements in the field of electronics.

Conclusion

Chi-Ming Lin's contributions to circuit board technology through his patents and collaborations highlight his role as an influential inventor. His work continues to impact the electronics industry positively.