Yuan Ze University

Kinsus Interconnect Technology Corp.

Cheng-En Ho

Cheng-Hsien Yang

Cheng-Yu Lee

Jaen-Don Lan

Yu-An Chen

Chi-Ming Lin

Shih-Ju Wang

Chen-Rui Tseng

Yu-Hui Wu

Bo-Zong Chen

Chih-Nan Chen

Wei-Hsiang Wu

Ling-Huang Hsu

Han-Lin Chung

Pin-Chung Lin

Bau-Chin Huang

A nanotwinned structure deposited on a surface of a substrate is provided. The nanotwinned structure includes at least one domain, and the domain includes a plurality of nanotwins. Each of the nanotwins possesses a faced-centered cubic (FCC) structure. The plurality of nanotwins are stacked along the [111] crystallographic axis. Less than 50% of a surface of the nanotwinned structure takes the (111) as the preferred orientation.

Nanotwinned structure

Disclosed is a method for manufacturing a circuit board, including preparing a substrate having a resin layer and a stop layer, forming at least one conduction hole penetrating the resin layer and stopping at the stop layer, forming a first metal layer through a sputtering process, forming a second metal layer on the first metal layer through a chemical plating process, forming a third metal layer having a circuit pattern, exposing part of the second metal layer and filling up the conduction hole through an electroplating process, and etching the second metal layer and the first metal layer under the second metal layer to expose the resin layer under the first metal layer. Since the first metal layer provides excellent surface properties, the second and third metal layers are well fixed and stable. The etched circuit pattern has a line width/pitch less than 10 &#x3bc;m for fine line width/pitch.

Method for manufacturing circuit board

An adjustable fixture structure for a 3D X-ray CT device is disclosed. Only the detected article is fixed on the fixture element of the adjustable fixture structure, may the adjustable connecting element slide with respect to the adjustable sliding trough and the fixture element slide with respect to the fixture sliding trough, so that the detected article is adjusted into within the detection range of the 3D X-ray CT device by using the adjustable connecting element and the fixture element. As such, the issues which a detected article is difficult to be oriented and positioned, a detection efficacy and result is poor, and the detected article might thus be damaged, may be well overcome.

Adjustable fixture structure for 3-dimensional X-ray computed tomography

A solder joint with a multilayer IMC structure is provided. The solder joint includes a Cu pad, a Sn-based solder, a first, a second, and a third IMC layer. The Cu pad is disposed opposite to the Sn-based solder. The first IMC layer is disposed between the Cu pad and the Sn-based solder. The first IMC layer is a CuSn layer. The second IMC layer is disposed between the first IMC layer and the Sn-based solder. The second IMC layer is a (CuNiPd)Snlayer, wherein x1 is in the range between 0 and 0.15, and y1 is in the range between 0 and 0.02. The third IMC layer is disposed between the second IMC layer and the Sn-based solder. The third IMC layer is a (CuNiPd)Snlayer, wherein x2 is in the range between 0 and 0.4, y2 is in the range between 0 and 0.02, and x2&#x3e;x1.

Solder joint with a multilayer intermetallic compound structure

A method for controlling the beta-tin crystal orientation in solder joints is provided. The method is suitable for joining metallization pads using a solder containing tin and silver. By adjusting the silver content in the solder within a specific range of equal to or more than 2.5 wt. % and less than 3.2 wt. %, the [001] axes of beta-tin crystals in the solder is aligned to be in the direction parallel with a solder/metallization pad interface substantially. Electromigration-induced solder deformations and metallization pad consumption can be significantly reduced when solder joints have such a microstructure. Additionally, the undesired AgSn plates in the solder matrix can be avoided accordingly.

Method for controlling beta-tin orientation in solder joints

A method for inhibiting electromigration-induced phase segregation suitable for solder joint configurations used in a chip package is described as following. First, a chip package including a wiring board, a chip and numbers of solder joints is provided, wherein the chip is disposed on the wiring board, and the solder joints are disposed between the chip and the wiring board to electrically connect the chip to the wiring board. Next, a first current and a second current are alternately applied to a side of the solder joints, wherein flowing directions of the first current and the second current are opposite. The current density of the first current is 10&#x2dc;10A/cm, and the current density of the second current is 10&#x2dc;10A/cm.

Method for inhibiting electromigration-induced phase segregation in solder joints

A method for inhibiting the growth of a nickel-copper-tin intermetallic (i.e. (Ni,Cu)Sn) layer at the (Cu,Ni)Sn/nickel interface of a solder joint is described as follows. A Sn&#x2014;Ag&#x2014;Cu solder alloy with a Cu-content of 0.5&#x2dc;1 weight percent (wt. %) is provided. The solder alloy is disposed on a surface finish of a soldering pad, having a nickel-based metallization layer. A material of the solder alloy further includes palladium. The solder alloy is joined with the surface finish, so as to form the solder joint containing palladium that enables to inhibit the growth of the undesired (Ni,Cu)Snlayer between the (Cu,Ni)Snand nickel in the subsequent use at temperatures ranging from 100&#xb0; C. to 180&#xb0; C.

Method for inhibiting growth of nickel-copper-tin intermetallic layer in solder joints

A high speed ball shear machine is adapted for removing a metal bump fixed on a substrate. The high speed ball shear machine includes a fixing base, a shear tool, and a metal bump catcher. The substrate is fixed on the top surface of the fixing base. The shear tool is disposed above the top surface. The fixing base is adapted for being translated along a translation path relative to the shear tool, wherein the translation path is a straight path. When the fixing base translates along the path, the metal bump is driven to strike the shear tool so as to separate itself from the substrate. The metal bump catcher, which is adapted for catching the drop bump after the striking, is disposed on the side wall of the fixing base. The bump catcher has a fillister with a configuration depicted in the figures of this invention.

Growing community of inventors

Taipei, Taiwan

Cheng-En Ho