Alor Gajah, Malaysia

Chee Chian Lim

This inventor holds 12 USPTO granted patents and 1 published patent application. Top assignee: Infineon Technologies Ag. Active years: 2009-2014.

USPTO Granted Patents = 12 

% Patents Active = 41.7

Average Co-Inventor Count = 1.3

ph-index = 3

Forward Citations = 185(Granted Patents)


Location History:

  • Alor Gajah Malaka, MY (2011)
  • Melaka, MY (2009 - 2014)
  • Alor Gajah Melaka, MY (2009 - 2014)

Company Filing History:


Years Active: 2009-2014

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12 patents (USPTO):Explore Patents

Title: Innovations by Chee Chian Lim

Introduction

Chee Chian Lim is a notable inventor based in Alor Gajah, Malaysia. He has made significant contributions to the field of semiconductor packaging, holding a total of 12 patents. His work has advanced the technology used in the manufacturing and assembly of semiconductor devices.

Latest Patents

One of his latest patents is a method of packaging a die. This method involves attaching a die to a substrate, where a major surface of the die is covered with a tape segment that has an array of apertures aligned with the electrical contacts. Solder balls are inserted into these apertures, allowing the die to be positioned against a substrate with the solder balls aligned with the die pads on the substrate's surface. A heat treatment process is then performed to bond the conductive elements to the corresponding bond pads. Another significant patent is related to a semiconductor device and a method of packaging it with a clip. This invention features a clip that defines both a first and a second contact region on the same face, enhancing the efficiency of the packaging process.

Career Highlights

Chee Chian Lim is currently employed at Infineon Technologies AG, a leading company in semiconductor solutions. His work at Infineon has allowed him to focus on innovative packaging methods that improve the performance and reliability of semiconductor devices.

Collaborations

He has collaborated with several talented individuals in his field, including Yoke Chin Goh and Boon Huat Lim. These collaborations have contributed to the successful development of his patented technologies.

Conclusion

Chee Chian Lim's contributions to semiconductor packaging through his innovative patents have made a significant impact in the industry. His work continues to influence advancements in technology and improve manufacturing processes.

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