The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 01, 2011
Filed:
May. 04, 2009
Chee Chian Lim, Alor Gajah Malaka, MY;
Yoke Chin Goh, Tangkak Johor, MY;
Koh Hoo Goh, Muar Johor, MY;
May Ting Hng, Bukit Baru Melaka, MY;
Chee Chian Lim, Alor Gajah Malaka, MY;
Yoke Chin Goh, Tangkak Johor, MY;
Koh Hoo Goh, Muar Johor, MY;
May Ting Hng, Bukit Baru Melaka, MY;
Infineon Technologies AG, Neubiberg, DE;
Abstract
An electronic component includes a number of leads and at least one cooling element. The bottom surface of the cooling element is exposed and the material of the cooling element is different from the material of the leads. At least one semiconductor chip is provided on the cooling element. An encapsulation compound covers at least part of the leads, at least part of the semiconductor chip(s), and at least part of the cooling element(s).