The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 09, 2014
Filed:
Sep. 18, 2013
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventor:
Chee Chian Lim, Alor Gajah Melaka, MY;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 24/50 (2013.01); H01L 24/11 (2013.01); H01L 2224/13022 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/01006 (2013.01); H01L 2224/13099 (2013.01); H01L 24/16 (2013.01); H01L 2224/83191 (2013.01); H01L 2924/01082 (2013.01); H01L 23/49616 (2013.01); H01L 2924/00013 (2013.01); H01L 2924/01033 (2013.01); H01L 2224/131 (2013.01); H01L 2924/0001 (2013.01); H01L 23/49822 (2013.01); H01L 2924/01068 (2013.01); H01L 2924/01075 (2013.01); H01L 2224/16 (2013.01); H01L 23/3164 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/19043 (2013.01); H01L 24/13 (2013.01); H01L 24/81 (2013.01);
Abstract
A method of attaching a die to a substrate is disclosed. A major surface of the die has an array of electrical contacts, and is covered with a tape segment having an array of apertures in register with the contacts. Solder balls are inserted into the apertures. The die is positioned against a substrate with the solder balls in register with the die pads on the surface of the substrate, and a heat treatment process is performed to bond the conductive elements to the corresponding bond pads.