The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 12, 2013
Filed:
Apr. 23, 2010
Chee Chian Lim, Alor Gajah Melaka, MY;
Chee Chian Lim, Alor Gajah Melaka, MY;
Infineon Technologies AG, Neubiberg, DE;
Abstract
In an embodiment, a die package may be provided. The die package may include at least one first height adjusting structure, the at least one first height adjusting structure may include a first adjusting height relative to a common plane; at least one second height adjusting structure may be positioned adjacent to the at least one first height adjusting structure, the at least one second height adjusting structure may include a second adjusting height relative to the common plane; wherein the second adjusting height may be different from the first adjusting height relative to the common plane; a first die may be positioned on the at least one first height adjusting structure; and a mold housing substantially surrounding the at least one first height adjusting structure, the at least one second height adjusting structure and the first die.