Kaohsiung, Taiwan

Che-Wei Hsu

This inventor holds 19 USPTO granted patents and 2 published patent applications, primarily in Integrated Fan-Out Packaging. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2018-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Che-Wei Hsu. Retrieved from https://idiyas.com/inventor/che-wei-hsu-v6ekummz

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 19 

% Patents Active = 100.0

Average Co-Inventor Count = 4.8

ph-index = 3

Forward Citations = 38(Granted Patents)


Company Filing History:


Years Active: 2018-2026

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Areas of Expertise:
Integrated Fan-Out Package
Package Structure
Electronic Apparatus
Manufacturing Method
Antenna Design
Device Fabrication
Thermal Management
3D Packaging
Interconnect Technology
Packaging Solutions
Electronic Devices
Advanced Packaging
19 patents (USPTO):Explore Patents

Title: **The Innovations of Che-Wei Hsu: Pioneering Patents in Semiconductor Technology**

Introduction

Che-Wei Hsu, a distinguished inventor based in Kaohsiung, Taiwan, has made significant contributions to the field of semiconductor technology. With a remarkable portfolio of 16 patents, Hsu has developed several advanced systems and methodologies that enhance the efficiency and functionality of semiconductor devices.

Latest Patents

Among Hsu's most recent patents are innovations related to the manufacturing of systems on silicon wafer (SoSW) devices. These patents describe a range of techniques for forming multiple functional dies in a silicon wafer using various masks for different die types. Notably, Hsu has developed a first redistribution structure that enables local interconnects between adjacent dies, along with a second redistribution structure for semi-global and global interconnects among non-adjacent dies. An optional backside redistribution structure further enhances connectivity, providing backside interconnects between different types of functional dies.

Another notable invention includes an electronic apparatus that comprises an integrated fan-out package, complemented by a dielectric housing and a series of conductive patterns. This innovative design facilitates improved interaction and performance among the components.

Career Highlights

Che-Wei Hsu is employed at Taiwan Semiconductor Manufacturing Company Limited (TSMC), a leading organization in semiconductor manufacturing. His work there has allowed him to explore his passion for innovation, culminating in an impressive array of patents that showcase his technical expertise and visionary approach.

Collaborations

Throughout his career, Hsu has collaborated with notable professionals such as Chuei-Tang Wang and Chung-Hao Tsai. Together, they have pushed the boundaries of semiconductor technology, contributing to TSMC’s reputation as a pioneer in the industry.

Conclusion

Che-Wei Hsu's contributions to semiconductor technology are invaluable, reflected through his numerous patents and collaborative efforts. His commitment to innovation positions him as a significant figure in the field, paving the way for future advancements in semiconductor applications.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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