Company Filing History:
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Years Active: 2002-2005
Title: Innovations of Charles Tseng
Introduction
Charles Tseng is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His work focuses on methods that enhance the efficiency and effectiveness of electroplating processes.
Latest Patents
One of his latest patents is titled "Method and apparatus for pretreating a substrate prior to electroplating." This method involves providing a substrate with a contact pad and an under bump metallurgy, along with a photoresist layer. The photoresist layer has an opening that aligns with the contact pad, allowing for effective pretreatment with a wetting solution before plating a seed layer. Another significant patent is "Method to make wafer laser marks visible after bumping process." This wafer bumping method ensures that wafer identification characters are readable by optical character recognition after the bumping process.
Career Highlights
Throughout his career, Charles Tseng has worked with prominent companies in the semiconductor industry, including Taiwan Semiconductor Manufacturing Company Ltd. and Siliconware Precision Industries Co., Ltd. His experience in these organizations has contributed to his expertise in developing innovative solutions for semiconductor manufacturing.
Collaborations
Charles has collaborated with talented individuals such as Ta-Yang Lin and Kuo-Feng Chen. These collaborations have further enriched his work and led to advancements in the technologies he has developed.
Conclusion
Charles Tseng's contributions to the field of semiconductor technology through his patents and collaborations highlight his innovative spirit and dedication to advancing the industry. His work continues to influence the methods used in electroplating and wafer processing.