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Taichung, Taiwan

Chao-Dung Suo

This inventor holds 4 USPTO granted patents. Top assignee: Siliconware Precision Industries Co., Ltd.. Active years: 2002-2009.

USPTO Granted Patents = 4

% Patents Active = 100.0

Average Co-Inventor Count = 3.9

ph-index = 4

Forward Citations = 51(Granted Patents)

Location History:

Taichung, TW (2002)
Taiwan, CN (2009)

Company Filing History:

Siliconware Precision Industries Co., Ltd.

Years Active: 2002-2009

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4 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 7489037 - Semiconductor device and fabrication method thereof (2009-02-10),

2. 6404064 - Flip-chip bonding structure on substrate for flip-chip package application (2002-06-11),

3. 6348740 - Bump structure with dopants (2002-02-19),

4. 6348401 - Method of fabricating solder bumps with high coplanarity for flip-chip application (2002-02-19),

Profile summary based on public USPTO records.

Please report any incorrect information to [email protected]

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