The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 11, 2002
Filed:
Jul. 17, 2000
Ying-Chou Tsai, Hsinchu, TW;
Shih-Kuang Chiu, Taichung, TW;
Kuo-Liang Mao, Taichung, TW;
Chao-Dung Suo, Taichung, TW;
Abstract
A flip-chip bonding structure on substrate for flip-chip package application is proposed, on which solder bumps can be bonded for electrically coupling a flip chip to the substrate. The proposed flip-chip bonding structure is characterized in that its solder-bump pads can be dimensionally-invariable irrespective of a positional deviation in solder mask due to misalignment. Moreover, the proposed flip-chip bonding structure can help allow each attached solder bump to be reduced in horizontal extent as compared to the prior art, so that neighboring solder bumps would be less likely short-circuited to each other and flip-chip underfill can be more easily implemented.