The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 19, 2002
Filed:
Sep. 05, 2000
Shih-Kuang Chiu, Taichung, TW;
Ying Chou Tsai, Taichung, TW;
Chao-Dung Suo, Taichung, TW;
Kuo-Liang Mao, Taichung Hsien, TW;
Siliconware Precision Industries Co., Ltd., Taichung Hsien, TW;
Abstract
A bump structure formed having dopants therein. The bump structure includes a substrate, a plurality of bonding pads, a die and a plurality of bumps. The substrate has a first surface. The plurality of bonding pads is formed on the first surface of the substrate. The die has an active surface. Each bump at least includes a base and a plurality of dopants. The bumps are formed on the active surface of the die. The active surface of the die faces the first surface of the substrate. The substrate and the die are aligned such that each bump on the die corresponds with a bonding pad on the substrate. Dopants in the bump structure are made to contact the bonding pads on the substrate.