Chang-Yueh Chan

This inventor holds 12 USPTO granted patents and 2 published patent applications. Top assignee: Siliconware Precision Industries Co., Ltd.. Active years: 2010-2016.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chang-Yueh Chan. Retrieved from https://idiyas.com/inventor/chang-yueh-chan

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 12 (Patent Applications = 2)

% Patents Active = 50.0

Average Co-Inventor Count = 4.3

ph-index = 4

Forward Citations = 45(Granted Patents)

Location History:

Taichung Hsien, TW (2010)
Taichung, TW (2012 - 2016)

Company Filing History:

12 out of 826

Siliconware Precision Industries Co., Ltd.

patents

Years Active: 2010-2016

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12 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 9254994 - Package structure having MEMS element (2016-02-09),

2. 9130064 - Method for fabricating leadframe-based semiconductor package with connecting pads top and bottom surfaces of carrier (2015-09-08),

3. 8866236 - Package structure having MEMS element (2014-10-21),

4. 8716070 - Fabrication method of package structure having MEMS element (2014-05-06),

5. 8653661 - Package having MEMS element and fabrication method thereof (2014-02-18),

6. 8618641 - Leadframe-based semiconductor package (2013-12-31),

7. 8564115 - Package structure having micro-electromechanical element (2013-10-22),

8. 8471284 - LED package structure and fabrication method thereof (2013-06-25),

9. 8420430 - Fabrication method of package structure having MEMS element (2013-04-16),

10. 8198689 - Package structure having micro-electromechanical element and fabrication method thereof (2012-06-12),

11. 8154115 - Package structure having MEMS element and fabrication method thereof (2012-04-10),

12. 7858446 - Sensor-type semiconductor package and fabrication method thereof (2010-12-28),

Title: Chang-Yueh Chan: Innovator in Semiconductor Packaging

Introduction

Chang-Yueh Chan is a prominent inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 12 patents. His innovative designs focus on enhancing the efficiency and functionality of semiconductor devices.

Latest Patents

Among his latest patents is a package structure having a MEMS element. This design includes a chip with electrical connecting pads and a MEMS element, covered by a lid that features a metal layer. The structure utilizes first and second sub-bonding wires for electrical connections, with an encapsulant that exposes the top ends of these wires. This package structure is notable for its reduced size, low costs, diverse bump locations, and improved EMI shielding effect. Another significant patent is a method for fabricating a leadframe-based semiconductor package with connecting pads on both the top and bottom surfaces of the carrier. This method involves a leadframe with a die pad and peripheral leads, allowing for efficient electrical connections and encapsulation of the semiconductor chip.

Career Highlights

Chang-Yueh Chan is currently employed at Siliconware Precision Industries Co., Ltd. His work has been instrumental in advancing semiconductor packaging technologies, making him a key figure in the industry.

Collaborations

He has collaborated with notable coworkers, including Chih-Ming Huang and Chun-Chi Ke, contributing to various innovative projects within the company.

Conclusion

Chang-Yueh Chan's contributions to semiconductor packaging through his patents and collaborations highlight his role as a leading inventor in the field. His work continues to influence the development of efficient and effective semiconductor technologies.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

2 patents pending: