The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 28, 2010
Filed:
Nov. 02, 2007
Chien-ping Huang, Hsinchu Hsien, TW;
Tse-wen Chang, Taichung Hsien, TW;
Chang-yueh Chan, Taichung Hsien, TW;
Cheng-yi Chang, Taichung Hsien, TW;
Chien-Ping Huang, Hsinchu Hsien, TW;
Tse-Wen Chang, Taichung Hsien, TW;
Chang-Yueh Chan, Taichung Hsien, TW;
Cheng-Yi Chang, Taichung Hsien, TW;
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Abstract
A sensor-type semiconductor package and a fabrication method thereof are provided. The fabrication method of the sensor-type semiconductor package includes steps of: providing a wafer having sensor chips; attaching light-permeable bodies to the sensor chips, wherein each light-permeable body has a covering layer and an adhesive layer; singulating the wafer so as to obtain a plurality of separated sensor chips with the light-permeable bodies attached thereon; attaching and electrically connecting the separated sensor chips to a substrate module having substrates, forming an encapsulant encapsulating the sensor chips and the light-permeable bodies; cutting the encapsulant along edges of the light-permeable bodies to a depth at least corresponding the bottom edges of the covering layers; removing the covering layers with the encapsulant mounted thereon to expose the light-permeable bodies; and cutting between the substrates to obtain a plurality of sensor-type semiconductor packages.