Siliconware Precision Industries Co., Ltd.

Chang-Yueh Chan

Chih-Ming Huang

Chun-Chi Ke

Chien-Ping Huang

Hsin-Yi Liao

Chi-Hsin Chiu

Shih-Kuang Chiu

Chun-Yuan Li

Chun-An Huang

Chih-Hsin Lai

Chieh-Lung Lai

Cheng-Yi Chang

Chih-Sheng Hsu

Tse-Wen Chang

A package structure having at least an MEMS element is provided, including a chip having electrical connecting pads and the MEMS element; a lid disposed on the chip to cover the MEMS element and having a metal layer provided thereon; first sub-bonding wires electrically connecting to the electrical connecting pads; second sub-bonding wires electrically connecting to the metal layer; an encapsulant disposed on the chip, wherein the top ends of the first and second sub-bonding wires are exposed from the encapsulant; and metallic traces disposed on the encapsulant and electrically connecting to the first sub-bonding wires. The package structure advantageously features reduced size, relatively low costs, diverse bump locations, and an enhanced EMI shielding effect.

Package structure having MEMS element

A semiconductor package and a method for fabricating the same are provided. A leadframe including a die pad and a plurality of peripheral leads is provided. A carrier, having a plurality of connecting pads formed thereon, is attached to the die pad, wherein a planar size of the carrier s greater than that of the die pad, allowing the connecting pads on the carrier to be exposed from the die pad. At least a semiconductor chip is attached to a side of an assembly including the die pad and the carrier, and is electrically connected to the connecting pads of the carrier and the leads via bonding wires. A package encapsulant encapsulates the semiconductor chip, the bonding wires, a part of the carrier and a part of the leadframe, allowing a bottom surface of the carrier and a part of the leads to be exposed from the package encapsulant.

Method for fabricating leadframe-based semiconductor package with connecting pads top and bottom surfaces of carrier

A fabrication method of a package structure having at least an MEMS element is provided, including: preparing a wafer having electrical connection pads and the at least an MEMS element; disposing lids for covering the at least an MEMS element, the lids having a metal layer formed thereon; electrically connecting the electrical connection pads and the metal layer with bonding wires; forming an encapsulant for covering the lids, bonding wires, electrical connection pads and metal layer; removing portions of the encapsulant to separate the bonding wires each into first and second sub-bonding wires, wherein top ends of the first and second sub-bonding wires are exposed, the first sub-bonding wires electrically connecting to the electrical connection pads, and the second sub-bonding wires electrically connecting to the metal layer; forming metallic traces on the encapsulant for electrically connecting to the first sub-bonding wires; forming bumps on the metallic traces; and performing a singulation process.

Fabrication method of package structure having MEMS element

A package structure having an MEMS element is provided, which includes: a protection layer having openings formed therein; conductors formed in the openings, respectively; conductive pads formed on the protection layer and the conductors; a MEMS chip disposed on the conductive pads; and an encapsulant formed on the protection layer for encapsulating the MEMS chip. By disposing the MEMS chip directly on the protection layer to dispense with the need for a carrier, such as a wafer or a circuit board that would undesirably add to the thickness, the present invention reduces the overall thickness of the package to thereby achieve miniaturization.

Package having MEMS element and fabrication method thereof

A semiconductor package and a method for fabricating the same are provided. A leadframe including a die pad and a plurality of peripheral leads is provided. A carrier, having a plurality of connecting pads formed thereon, is attached to the die pad, wherein a planar size of the carrier is greater than that of the die pad, allowing the connecting pads on the carrier to be exposed from the die pad. At least a semiconductor chip is attached to a side of an assembly including the die pad and the carrier, and is electrically connected to the connecting pads of the carrier and the leads via bonding wires. A package encapsulant encapsulates the semiconductor chip, the bonding wires, a part of the carrier and a part of the leadframe, allowing a bottom surface of the carrier and a part of the leads to be exposed from the package encapsulant.

Leadframe-based semiconductor package

Proposed is a package structure having a micro-electromechanical (MEMS) element, including a chip having a plurality of electrical connecting pads and a MEMS element formed thereon; a lid disposed on the chip for covering the MEMS element; a stud bump disposed on each of the electrical connecting pads; an encapsulant formed on the chip with part of the stud bumps being exposed from the encapsulant; and a metal conductive layer formed on the encapsulant and connected to the stud bumps. The invention is characterized by completing the packaging process on the wafer directly to enable thinner and cheaper package structures to be fabricated within less time. This invention further provides a method for fabricating the package structure as described above.

Package structure having micro-electromechanical element

An LED package structure includes: a carrier; at least a first protruding portion and a plurality of electrical contacts formed on the carrier; a plurality of LED chips disposed on the first protruding portion and on the carrier in a region free from the first protruding portion, respectively; a plurality of bonding wires electrically connecting the LED chips and the electrical contacts; and a phosphor covering the LED chips, the electrical contacts and the bonding wires. The LED chips are disposed at different heights so as to allow the portions of the phosphor on the LED chips to have different thicknesses and thus generate light with different color temperatures.

LED package structure and fabrication method thereof

Package structure having micro-electromechanical element and fabrication method thereof

A package structure having an MEMS element includes: a chip having at least an MEMS element and a plurality of first conductive pads; a lid disposed on the chip to cover the MEMS element and having a plurality of second conductive pads formed thereon; a plurality of bonding wires electrically connecting the first and second conductive pads; a plurality of first bumps disposed on the second conductive pads, respectively; an encapsulant formed on the chip to encapsulate the lid, the bonding wires, the first and second conductive pads and the first bumps while exposing the top surfaces of the first bumps; and a plurality of circuits formed on the encapsulant and electrically connecting to the exposed first bumps, thereby avoiding the conventional drawback of electrical connection failure caused by position deviation of bonding wires due to mold flow of the encapsulant.

Package structure having MEMS element and fabrication method thereof

A sensor-type semiconductor package and a fabrication method thereof are provided. The fabrication method of the sensor-type semiconductor package includes steps of: providing a wafer having sensor chips; attaching light-permeable bodies to the sensor chips, wherein each light-permeable body has a covering layer and an adhesive layer; singulating the wafer so as to obtain a plurality of separated sensor chips with the light-permeable bodies attached thereon; attaching and electrically connecting the separated sensor chips to a substrate module having substrates, forming an encapsulant encapsulating the sensor chips and the light-permeable bodies; cutting the encapsulant along edges of the light-permeable bodies to a depth at least corresponding the bottom edges of the covering layers; removing the covering layers with the encapsulant mounted thereon to expose the light-permeable bodies; and cutting between the substrates to obtain a plurality of sensor-type semiconductor packages.

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Taichung, Taiwan

Chang-Yueh Chan