The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 12, 2012
Filed:
Apr. 28, 2010
Chang-yueh Chan, Taichung, TW;
Chien-ping Huang, Tantzu, TW;
Chun-chi KE, Taichung Hsien, TW;
Chun-an Huang, Taichung, TW;
Chih-ming Huang, Hsinchu-Hsein, TW;
Chang-Yueh Chan, Taichung, TW;
Chien-Ping Huang, Tantzu, TW;
Chun-Chi Ke, Taichung Hsien, TW;
Chun-An Huang, Taichung, TW;
Chih-Ming Huang, Hsinchu-Hsein, TW;
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Abstract
Proposed is a package structure having a micro-electromechanical (MEMS) element, including a chip having a plurality of electrical connecting pads and a MEMS element formed thereon; a lid disposed on the chip for covering the MEMS element; a stud bump disposed on each of the electrical connecting pads; an encapsulant formed on the chip with part of the stud bumps being exposed from the encapsulant; and a metal conductive layer formed on the encapsulant and connected to the stud bumps. The invention is characterized by completing the packaging process on the wafer directly to enable thinner and cheaper package structures to be fabricated within less time. This invention further provides a method for fabricating the package structure as described above.