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Changwon-si, South Korea

Chang Jun Park

USPTO Granted Patents = 17 (Patent Applications = 1)

Average Co-Inventor Count = 2.3

ph-index = 5

Forward Citations = 90(Granted Patents)

Location History:

Kyoungki-do, KR (2008)
Kyeonggi-do, KR (2011)
Gyeonggi-do, KR (2010 - 2013)
Hwaseong-si, KR (2014)
Changwon-si, KR (2015 - 2022)

Company Filing History:

12 out of 6,228

Hynix Semiconductor Inc.

3 out of 18,640

Hyundai Motor Company

Kia Motors Corporation

4. 1 out of 10,980

where one patent can have more than one assignee

Years Active: 2008-2022

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17 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11479112 - Fuel tank venting system for hybrid vehicle (2022-10-25),

2. 9982623 - Apparatus and method for preventing overflow of fuel from vehicle fuel tank (2018-05-29),

3. 9163593 - Fuel heating device for improving cold start performance of flex fuel vehicle (2015-10-20),

4. 8869778 - Fuel supply system of vehicle (2014-10-28),

5. 8394717 - Semiconductor package with a reduced volume and thickness and capable of high speed operation and method for fabricating the same (2013-03-12),

6. 8358016 - Semiconductor package having an internal cooling system (2013-01-22),

7. 8338921 - Wafer level chip scale package having an enhanced heat exchange efficiency with an EMF shield and a method for fabricating the same (2012-12-25),

8. 8232642 - Printed circuit board (2012-07-31),

9. 8159065 - Semiconductor package having an internal cooling system (2012-04-17),

10. 8044516 - Semiconductor package with a reduced volume and thickness and capable of high speed operation and method for fabricating the same (2011-10-25),

11. 7989264 - Warpage resistant semiconductor package and method for manufacturing the same (2011-08-02),

12. 7898834 - Semiconductor chip with chip selection structure and stacked semiconductor package having the same (2011-03-01),

13. 7859102 - Multi-layer stacked wafer level semiconductor package module (2010-12-28),

14. 7795718 - Warpage resistant semiconductor package and method for manufacturing the same (2010-09-14),

15. 7795139 - Method for manufacturing semiconductor package (2010-09-14),

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