The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 25, 2012
Filed:
Nov. 04, 2011
Chang Jun Park, Gyeonggi-do, KR;
Kwon Whan Han, Seoul, KR;
Seong Cheol Kim, Seoul, KR;
Sung Min Kim, Seoul, KR;
Hyeong Seok Choi, Seoul, KR;
Ha NA Lee, Gyeonggi-do, KR;
Tac Keun OH, Gyeonggi-do, KR;
Sang Joon Lim, Gyeonggi-do, KR;
Chang Jun Park, Gyeonggi-do, KR;
Kwon Whan Han, Seoul, KR;
Seong Cheol Kim, Seoul, KR;
Sung Min Kim, Seoul, KR;
Hyeong Seok Choi, Seoul, KR;
Ha Na Lee, Gyeonggi-do, KR;
Tac Keun Oh, Gyeonggi-do, KR;
Sang Joon Lim, Gyeonggi-do, KR;
SK Hynix Inc., Gyeonggi-do, KR;
Abstract
A wafer level chip scale package having an enhanced heat exchange efficiency with an EMF shield is presented. The wafer level chip scale package includes a semiconductor chip, an insulation layer, and a metal plate. The semiconductor chip has a plurality of bonding pads on an upper face thereof. The insulation layer is disposed over the upper face of the semiconductor chip and has openings that expose some portions of the bonding pads. The metal plate covers an upper face of the insulation layer and side faces of the semiconductor chip in which the metal plate is electrically insulated from the bonding pads.