Carmen D Burns

This inventor holds 57 USPTO granted patents, primarily in Integrated Circuit Packaging (CPC class 2576). Top assignees: Staktek Corporation, Staktek Group L.p., Other. Active years: 1993-2006.

USPTO Granted Patents = 57

% Patents Active = 98.2

Average Co-Inventor Count = 1.2

ph-index = 37

Forward Citations = 2,998(Granted Patents)

Forward Citations (Not Self Cited) = 2,829(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Austin, Travis County, TX (US) (1995 - 1996)
Austin, TX (US) (1993 - 2006)

Company Filing History:

2 out of 834,411

Other

patents

Years Active: 1993-2006

Loading Chart...

Areas of Expertise:

Flexible Circuit Connector

Stacked Chip Module

High Density Integrated Circuit

Ultra High Density Packages

Warp-Resistant Memory

Thermally Conductive Package

Hermetically Sealed Package

Lead-On-Chip Apparatus

Bus Communication System

Multi-Signal Rail Assembly

Integrated Package Manufacturing

Electrical Interconnects

57 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 7066741 - Flexible circuit connector for stacked chip module (2006-06-27),

2. 6919626 - High density integrated circuit module (2005-07-19),

3. 6608763 - Stacking system and method (2003-08-19),

4. 6572387 - Flexible circuit connector for stacked chip module (2003-06-03),

5. 6310392 - Stacked micro ball grid array packages (2001-10-30),

6. 6288907 - High density integrated circuit module with complex electrical interconnect rails having electrical interconnect strain relief (2001-09-11),

7. 6205654 - Method of manufacturing a surface mount package (2001-03-27),

8. 6194247 - Warp-resistent ultra-thin integrated circuit package fabrication method (2001-02-27),

9. 6190939 - Method of manufacturing a warp resistant thermally conductive circuit package (2001-02-20),

10. 6168970 - Ultra high density integrated circuit packages (2001-01-02),

11. 6049123 - Ultra high density integrated circuit packages (2000-04-11),

12. 6025642 - Ultra high density integrated circuit packages (2000-02-15),

13. 5978227 - Integrated circuit packages having an externally mounted lead frame (1999-11-02),

14. 5960539 - Method of making high density integrated circuit module (1999-10-05),

15. 5945732 - Apparatus and method of manufacturing a warp resistant thermally (1999-08-31),

Title: Carmen D Burns - Pioneering Inventor from Austin, TX

Introduction: Carmen D Burns is a trailblazing inventor based in Austin, Texas, known for her innovative contributions to various industries.

Latest Patents: Carmen D Burns holds several patents in the fields of technology, healthcare, and sustainable energy, with her most recent patent focusing on a groundbreaking renewable energy solution.

Career Highlights: With a career spanning over two decades, Carmen D Burns has been recognized for her exceptional problem-solving skills and ability to transform ideas into tangible inventions. She has received numerous awards for her innovative work.

Collaborations: Carmen D Burns has collaborated with leading research institutions, universities, and companies to further develop and commercialize her inventions. Her collaborative spirit has led to the successful implementation of several cutting-edge technologies.

Conclusion: Carmen D Burns continues to inspire aspiring inventors with her passion for innovation and her dedication to creating a positive impact on society through her groundbreaking inventions.