For the Inventor, By the Inventor

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Austin, TX, United States of America

Staktek Group L.p.

Calculating rank

USPTO Granted Patents = 42

% Expired Patents = 14.3

Forward Citations = 1,657

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25 inventors (with patents filed for the assignee):

James Douglas Wehrly, Jr (21 out of 48 patents)

David Roper (19 out of 31 patents)

James W Cady (17 out of 39 patents)

4. James G Wilder (14 out of 30 patents)

5. Jeff Buchle (10 out of 13 patents)

6. Carmen D Burns (10 out of 57 patents)

7. Russell Rapport (8 out of 14 patents)

8. Julian Partridge (7 out of 21 patents)

9. Julian Dowden (5 out of 6 patents)

10. Glen E Roeters (3 out of 13 patents)

11. Paul Goodwin (2 out of 25 patents)

12. Jeffrey Alan Buchle (2 out of 4 patents)

13. Andrew C Ross (2 out of 8 patents)

14. Leland Szewerenko (1 out of 10 patents)

15. Ron Orris (1 out of 4 patents)

Core Competencies:

Stacked Module Systems

Integrated Circuit Stacking

Memory Expansion

Chip Scale Stacking

Thin Module System

Flexible Circuit Connector

High Density Packaging

Pitch Change Stacking

Low Profile Stacking

CSP Chip Stack

Thermally Conductive Package

Micro Ball Grid Array

42 patents: Sort by Forward Citations

1. 7371609 - Stacked module systems and methods (2008-05-13),

2. 7335975 - Integrated circuit stacking system and method (2008-02-26),

3. 7324352 - High capacity thin module system and method (2008-01-29),

4. 7323364 - Stacked module systems and method (2008-01-29),

5. 7310458 - Stacked module systems and methods (2007-12-18),

6. 7309914 - Inverted CSP stacking system and method (2007-12-18),

7. 7304382 - Managed memory component (2007-12-04),

8. 7259452 - Leaded package integrated circuit stacking (2007-08-21),

9. 7256484 - Memory expansion and chip scale stacking system and method (2007-08-14),

10. 7202555 - Pitch change and chip scale stacking system and method (2007-04-10),

11. 7180167 - Low profile stacking system and method (2007-02-20),

12. 7094632 - Low profile chip scale stacking system and method (2006-08-22),

13. 7081373 - CSP chip stack with flex circuit (2006-07-25),

14. 7066741 - Flexible circuit connector for stacked chip module (2006-06-27),

15. 7053478 - Pitch change and chip scale stacking system (2006-05-30),

Company Overview

Staktek Group L.P., based in Austin, TX, specializes in advanced semiconductor packaging technologies. The company focuses on the development and manufacturing of stacked module systems and integrated circuit stacking solutions, aimed at enhancing memory expansion and performance in high-density integrated circuits. Their expertise extends to chip scale stacking, thin module systems, and flexible circuit connectors, positioning them as a key player in the evolution of ball grid array packages and next-generation electronic devices.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 20 2026

42 Patents

#72 in Austin, TX

#459 in Texas

#8,266 in US

#16,374 in the World

Austin, TX, United States of America

Staktek Group L.p.

Forward Citations = 1,657

25 inventors:

James Douglas Wehrly, Jr (21 out of 48 patents)

David Roper (19 out of 31 patents)

James W Cady (17 out of 39 patents)

4. James G Wilder (14 out of 30 patents)

5. Jeff Buchle (10 out of 13 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Staktek Group L.p.. Retrieved from https://idiyas.com/company/staktek-group

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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