For the Inventor, By the Inventor

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Austin, TX, United States of America

Staktek Group L.p.

USPTO Granted Patents = 42

Forward Citations = 1,654

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25 inventors (with patents filed for the assignee):

James Douglas Wehrly, Jr (21 out of 48 patents)

David Roper (19 out of 31 patents)

James W Cady (17 out of 39 patents)

4. James G Wilder (14 out of 30 patents)

5. Jeff Buchle (10 out of 13 patents)

6. Carmen D Burns (10 out of 57 patents)

7. Russell Rapport (8 out of 14 patents)

8. Julian Partridge (7 out of 21 patents)

9. Julian Dowden (5 out of 6 patents)

10. Glen E Roeters (3 out of 13 patents)

11. Paul Goodwin (2 out of 25 patents)

12. Jeffrey Alan Buchle (2 out of 4 patents)

13. Andrew C Ross (2 out of 8 patents)

14. Leland Szewerenko (1 out of 10 patents)

15. Ron Orris (1 out of 4 patents)

Core Competencies:

Stacked Module Systems

Integrated Circuit Stacking

Memory Expansion

Chip Scale Stacking

Thin Module Systems

Flexible Circuit Connectors

High Density Integrated Circuits

Ball Grid Array Packages

Contact Member Stacking

Warp Resistant Packages

Pitch Change Stacking

Three-Dimensional Modules

42 patents: Sort by Forward Citations

1. 7371609 - Stacked module systems and methods (2008-05-13),

2. 7335975 - Integrated circuit stacking system and method (2008-02-26),

3. 7324352 - High capacity thin module system and method (2008-01-29),

4. 7323364 - Stacked module systems and method (2008-01-29),

5. 7310458 - Stacked module systems and methods (2007-12-18),

6. 7309914 - Inverted CSP stacking system and method (2007-12-18),

7. 7304382 - Managed memory component (2007-12-04),

8. 7259452 - Leaded package integrated circuit stacking (2007-08-21),

9. 7256484 - Memory expansion and chip scale stacking system and method (2007-08-14),

10. 7202555 - Pitch change and chip scale stacking system and method (2007-04-10),

11. 7180167 - Low profile stacking system and method (2007-02-20),

12. 7094632 - Low profile chip scale stacking system and method (2006-08-22),

13. 7081373 - CSP chip stack with flex circuit (2006-07-25),

14. 7066741 - Flexible circuit connector for stacked chip module (2006-06-27),

15. 7053478 - Pitch change and chip scale stacking system (2006-05-30),

Staktek Group L.P. is a leading provider of innovative stacking solutions for the electronics industry. With a focus on advanced memory technologies, Staktek offers a wide range of high-performance products and services. Their portfolio includes custom memory module design, manufacturing, and testing solutions, as well as unique stacking and interconnect technologies that enable higher capacity and performance in compact form factors. Staktek serves a diverse customer base, including leading OEMs, memory module manufacturers, and semiconductor companies. With a commitment to quality and reliability, Staktek is dedicated to delivering cutting-edge solutions that meet the demands of the rapidly evolving electronics market.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 23 2025

42 Patents

#71 in Austin, TX

#457 in Texas

#7,977 in US

#15,852 in the World

Austin, TX, United States of America

Staktek Group L.p.

Forward Citations = 1,654

25 inventors:

James Douglas Wehrly, Jr (21 out of 48 patents)

David Roper (19 out of 31 patents)

James W Cady (17 out of 39 patents)

4. James G Wilder (14 out of 30 patents)

5. Jeff Buchle (10 out of 13 patents)

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