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Austin, TX, United States of America

Staktek Corporation

USPTO Granted Patents = 48

Forward Citations = 2,531

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5 inventors (with patents filed for the assignee):

Carmen D Burns (45 out of 57 patents)

Jerry Mark Roane (10 out of 19 patents)

James W Cady (7 out of 39 patents)

4. Phillip R Troetschel (2 out of 3 patents)

5. Philip R Troetschel (1 out of 1 patent)

Core Competencies:

Ultra High Density Integrated Circuits

Integrated Circuit Packages

Warp-Resistant Memory Modules

Hermetically Sealed Packages

Lead-On-Chip Technology

Bus Communication Systems

Thermally Resistant Modules

Multi-Signal Rail Assemblies

High Density Fabrication Methods

Capacitive Coupling Configurations

Three-Dimensional Integrated Circuits

Snap-On Rail Assemblies

48 patents: Sort by Forward Citations

1. 6049123 - Ultra high density integrated circuit packages (2000-04-11),

2. 6025642 - Ultra high density integrated circuit packages (2000-02-15),

3. 5978227 - Integrated circuit packages having an externally mounted lead frame (1999-11-02),

4. 5960539 - Method of making high density integrated circuit module (1999-10-05),

5. 5945732 - Apparatus and method of manufacturing a warp resistant thermally (1999-08-31),

6. 5895232 - Three-dimensional warp-resistant integrated circuit module method and (1999-04-20),

7. 5864175 - Wrap-resistant ultra-thin integrated circuit package fabrication method (1999-01-26),

8. 5843807 - Method of manufacturing an ultra-high density warp-resistant memory (1998-12-01),

9. 5828125 - Ultra-high density warp-resistant memory module (1998-10-27),

10. 5804870 - Hermetically sealed integrated circuit lead-on package configuration (1998-09-08),

11. 5801437 - Three-dimensional warp-resistant integrated circuit module method and (1998-09-01),

12. 5783464 - Method of forming a hermetically sealed circuit lead-on package (1998-07-21),

13. 5778522 - Method of manufacturing a high density integrated circuit module with (1998-07-14),

14. 5702985 - Hermetically sealed ceramic integrated circuit heat dissipating package (1997-12-30),

15. 5654877 - Lead-on-chip integrated circuit apparatus (1997-08-05),

Staktek Corporation is a leading provider of innovative semiconductor and storage solutions. They specialize in developing advanced stacking and interconnect technologies to improve performance, reduce costs, and enable new applications in the semiconductor industry. With expertise in chip packaging, memory solutions, and high-speed connectivity, Staktek offers a wide range of products and services to meet the evolving needs of the market. Visit their website to learn more about their technology solutions and industry expertise.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Jan 6 2026

48 Patents

#57 in Austin, TX

#389 in Texas

#7,029 in US

#14,128 in the World

Austin, TX, United States of America

Staktek Corporation

Forward Citations = 2,531

5 inventors:

Carmen D Burns (45 out of 57 patents)

Jerry Mark Roane (10 out of 19 patents)

James W Cady (7 out of 39 patents)

4. Phillip R Troetschel (2 out of 3 patents)

5. Philip R Troetschel (1 out of 1 patent)

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