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Austin, TX, United States of America

Staktek Corporation

USPTO Granted Patents = 48

Forward Citations = 2,536

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5 inventors (with patents filed for the assignee):

Carmen D Burns (45 out of 57 patents)

Jerry Mark Roane (10 out of 19 patents)

James W Cady (7 out of 39 patents)

4. Phillip R Troetschel (2 out of 3 patents)

5. Philip R Troetschel (1 out of 1 patent)

Core Competencies:

Integrated Circuit

High Density

Warp-Resistant

Memory Module

Lead-On-Chip

Hermetically Sealed

Fabrication Method

Multi-Signal Rail

Thermal Management

Interconnects

Bus Communication

Ultra-Thin Package

48 patents: Sort by Forward Citations

1. 6049123 - Ultra high density integrated circuit packages (2000-04-11),

2. 6025642 - Ultra high density integrated circuit packages (2000-02-15),

3. 5978227 - Integrated circuit packages having an externally mounted lead frame (1999-11-02),

4. 5960539 - Method of making high density integrated circuit module (1999-10-05),

5. 5945732 - Apparatus and method of manufacturing a warp resistant thermally (1999-08-31),

6. 5895232 - Three-dimensional warp-resistant integrated circuit module method and (1999-04-20),

7. 5864175 - Wrap-resistant ultra-thin integrated circuit package fabrication method (1999-01-26),

8. 5843807 - Method of manufacturing an ultra-high density warp-resistant memory (1998-12-01),

9. 5828125 - Ultra-high density warp-resistant memory module (1998-10-27),

10. 5804870 - Hermetically sealed integrated circuit lead-on package configuration (1998-09-08),

11. 5801437 - Three-dimensional warp-resistant integrated circuit module method and (1998-09-01),

12. 5783464 - Method of forming a hermetically sealed circuit lead-on package (1998-07-21),

13. 5778522 - Method of manufacturing a high density integrated circuit module with (1998-07-14),

14. 5702985 - Hermetically sealed ceramic integrated circuit heat dissipating package (1997-12-30),

15. 5654877 - Lead-on-chip integrated circuit apparatus (1997-08-05),

Staktek Corporation, based in Austin, TX, specializes in the development and manufacturing of advanced integrated circuit technologies. The company focuses on ultra high density integrated circuits and innovative packaging solutions, including hermetically sealed packages and warp-resistant memory modules. Staktek's expertise extends to lead-on-chip technology and bus communication systems, ensuring robust performance in thermally resistant modules and multi-signal rail assemblies. Their commitment to cutting-edge technology positions them as a key player in the semiconductor industry.

Profile summary based on public USPTO records.

Company Badge

USPTO Data Jan 1 1976 - Oct 6 2026

48 Patents

#57 in Austin, TX

#391 in Texas

#7,280 in US

#14,536 in the World

Austin, TX, United States of America

Staktek Corporation

Forward Citations = 2,536

5 inventors:

Carmen D Burns (45 out of 57 patents)

Jerry Mark Roane (10 out of 19 patents)

James W Cady (7 out of 39 patents)

4. Phillip R Troetschel (2 out of 3 patents)

5. Philip R Troetschel (1 out of 1 patent)

Please report any incorrect information to [email protected]

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