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Austin, TX, United States of America

Staktek Corporation

Calculating rank

USPTO Granted Patents = 48

Forward Citations = 2,537

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5 inventors (with patents filed for the assignee):

Carmen D Burns (45 out of 57 patents)

Jerry Mark Roane (10 out of 19 patents)

James W Cady (7 out of 39 patents)

4. Phillip R Troetschel (2 out of 3 patents)

5. Philip R Troetschel (1 out of 1 patent)

Core Competencies:

Integrated Circuit

High Density

Warp-Resistant

Memory Module

Lead-On-Chip

Hermetically Sealed

Fabrication Method

Multi-Signal Rail

Thermal Management

Interconnects

Bus Communication

Ultra-Thin Package

48 patents: Sort by Forward Citations

1. 6049123 - Ultra high density integrated circuit packages (2000-04-11),

2. 6025642 - Ultra high density integrated circuit packages (2000-02-15),

3. 5978227 - Integrated circuit packages having an externally mounted lead frame (1999-11-02),

4. 5960539 - Method of making high density integrated circuit module (1999-10-05),

5. 5945732 - Apparatus and method of manufacturing a warp resistant thermally (1999-08-31),

6. 5895232 - Three-dimensional warp-resistant integrated circuit module method and (1999-04-20),

7. 5864175 - Wrap-resistant ultra-thin integrated circuit package fabrication method (1999-01-26),

8. 5843807 - Method of manufacturing an ultra-high density warp-resistant memory (1998-12-01),

9. 5828125 - Ultra-high density warp-resistant memory module (1998-10-27),

10. 5804870 - Hermetically sealed integrated circuit lead-on package configuration (1998-09-08),

11. 5801437 - Three-dimensional warp-resistant integrated circuit module method and (1998-09-01),

12. 5783464 - Method of forming a hermetically sealed circuit lead-on package (1998-07-21),

13. 5778522 - Method of manufacturing a high density integrated circuit module with (1998-07-14),

14. 5702985 - Hermetically sealed ceramic integrated circuit heat dissipating package (1997-12-30),

15. 5654877 - Lead-on-chip integrated circuit apparatus (1997-08-05),

Company Overview

Staktek Corporation, based in Austin, TX, specializes in the development and manufacturing of advanced integrated circuit technologies. The company focuses on ultra high density integrated circuits and innovative packaging solutions, including hermetically sealed packages and warp-resistant memory modules. Staktek's expertise extends to lead-on-chip technology and bus communication systems, ensuring robust performance in thermally resistant modules and multi-signal rail assemblies. Their commitment to cutting-edge technology positions them as a key player in the semiconductor industry.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 27 2026

48 Patents

#57 in Austin, TX

#392 in Texas

#7,297 in US

#14,575 in the World

Austin, TX, United States of America

Staktek Corporation

Forward Citations = 2,537

5 inventors:

Carmen D Burns (45 out of 57 patents)

Jerry Mark Roane (10 out of 19 patents)

James W Cady (7 out of 39 patents)

4. Phillip R Troetschel (2 out of 3 patents)

5. Philip R Troetschel (1 out of 1 patent)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Staktek Corporation. Retrieved from https://idiyas.com/company/staktek

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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