The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 30, 1997
Filed:
Oct. 19, 1994
Applicant:
Inventor:
Carmen D Burns, Austin, TX (US);
Assignee:
Staktek Corporation, Austin, TX (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
437217 ; 437211 ; 437218 ; 437219 ; 437220 ; 437902 ; 257676 ; 257693 ; 257703 ; 257707 ;
Abstract
A method for achieving a hermetically sealed ceramic integrated circuit package having good thermal conductivity for efficiently transferring heat from an integrated circuit chip die contained therein. Use of an ultra-thin integrated circuit chip die, thin ceramic housing layers and external lead frame allow an ultra-thin overall package that may be used singularly or further densely packaged into a three dimensional multi-package array and still meet the critical performance and reliability requirements for both military and aerospace applications.