For the Inventor, By the Inventor

Enter inventor name

Taichung, Taiwan

Candy Tien

USPTO Granted Patents = 3

Average Co-Inventor Count = 5.6

ph-index = 3

Forward Citations = 169(Granted Patents)

Location History:

Taichung Hsien, TW (2001 - 2003)
Taichung, TW (2003)

Company Filing History:

Siliconware Precision Industries Co., Ltd.

Years Active: 2001-2003

Loading Chart...

3 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 6650015 - Cavity-down ball grid array package with semiconductor chip solder ball (2003-11-18),

2. 6552428 - Semiconductor package having an exposed heat spreader (2003-04-22),

3. 6246115 - Semiconductor package having a heat sink with an exposed surface (2001-06-12),

This text is generated by artificial intelligence and may not be accurate.

Please report any incorrect information to support@idiyas.com

Loading…