The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 18, 2003
Filed:
Jun. 14, 2002
Applicant:
Inventors:
Eing-Chieh Chen, Taichung, TW;
Shiu-Tai Tzung, Taichung, TW;
Ting-Ke Chai, Taichung, TW;
Jeng-Yuan Lai, Taichung, TW;
Candy Tien, Taichung, TW;
Assignee:
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/348 ;
U.S. Cl.
CPC ...
H01L 2/348 ;
Abstract
A cavity-down ball grid array package includes a substrate having a through cavity provided therein. A heat sink is attached to the substrate and a semiconductor chip in the cavity is attached to the heat sink and electrically connected to the substrate. A ball grid array is on the substrate and on the semiconductor chip.