This inventor holds 2 USPTO granted patents. Top assignee: Siliconware Precision Industries Co., Ltd.. Active years: 2002-2003.
Company Filing History:
Years Active: 2002-2003
Title: Innovations by Inventor Ting-Ke Chai
Introduction
Ting-Ke Chai is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on enhancing the reliability and efficiency of semiconductor packaging and testing methods.
Latest Patents
Ting-Ke Chai's latest patents include a "Cavity-down ball grid array package with semiconductor chip solder ball." This innovative package features a substrate with a through cavity, where a heat sink is attached to the substrate. A semiconductor chip is placed in the cavity and connected to the heat sink, with a ball grid array positioned on both the substrate and the semiconductor chip.
Another significant patent is the "Flip-chip bumping structure with dedicated test pads on semiconductor chip and method of fabricating the same." This technology introduces a flip-chip bumping structure that includes dedicated test pads on the semiconductor chip. The design allows for a lined-array of electrically-conductive dual-pad blocks over the internal I/O points of the chip. This innovation ensures that probing during testing does not damage the bump-pad portions, thereby enhancing the quality and reliability of solder bump attachments.
Career Highlights
Ting-Ke Chai is currently employed at Siliconware Precision Industries Co., Ltd., a leading company in the semiconductor packaging industry. His work has been instrumental in advancing the technology used in semiconductor manufacturing and testing.
Collaborations
Throughout his career, Ting-Ke Chai has collaborated with several talented individuals, including Pao-Ho Yuan and Lien-Chi Chan. These collaborations have contributed to the development of innovative solutions in the semiconductor field.
Conclusion
Ting-Ke Chai's contributions to semiconductor technology through his patents and collaborations highlight his role as a significant inventor in the industry. His work continues to influence advancements in semiconductor packaging and testing methods.