Yongin, South Korea

Byung-jun Park

This inventor holds 25 USPTO granted patents and 1 published patent application, primarily in Image Sensor Technology. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2004-2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Byung-jun Park. Retrieved from https://idiyas.com/inventor/byung-jun-park-p1x4j8o0

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 25 

% Patents Active = 76.0

Average Co-Inventor Count = 2.0

ph-index = 7

Forward Citations = 124(Granted Patents)


Location History:

  • Kyungki-do, KR (2004 - 2008)
  • Yongin-si, KR (2009 - 2022)

Company Filing History:


Years Active: 2004-2022

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Areas of Expertise:
Integrated Circuit Devices
Image Sensor
Through-Silicon Via
Semiconductor Devices
Backside Illumination
CMOS Image Sensors
Stack Type Sensor
Memory Devices
Cylindrical Capacitors
Etch-Delay Structures
Self-Aligned Metal Contacts
Fabrication Methods
25 patents (USPTO):Explore Patents

Title: Byung-jun Park: Innovator in Integrated Circuit Technologies

Introduction

Byung-jun Park, a distinguished inventor based in Yongin-si, South Korea, has made significant contributions to the field of integrated circuit technology. With a remarkable portfolio of 25 patents, Park stands out as a leading innovator in his domain, particularly in developing advanced integrated devices for modern electronic applications.

Latest Patents

Among his noteworthy inventions, Park's latest patents include groundbreaking developments in integrated circuit devices featuring through-silicon via (TSV) structures. This innovative IC device comprises a first substrate with a structured interlayer insulating layer that accommodates multiple conductive pad layers at varying levels. It is designed to enhance the efficiency and performance of integrated circuits.

Another significant patent involves an advanced image sensor that incorporates a substrate with a two-dimensional array of pixels. This image sensor includes a meticulous arrangement of insulating layers, color filters, micro-lenses, and a pixel separation structure that features a grid-like conductive layer. Such designs aim to improve image clarity and processing efficiency in electronic devices.

Career Highlights

Byung-jun Park's professional journey is amplified through his tenure at Samsung Electronics Co., Ltd., where he continues to push the boundaries of innovation. His expertise in integrated circuit design not only highlights his technical skills but also emphasizes his role in keeping Samsung at the forefront of technological advancements.

Collaborations

Throughout his career, Park has collaborated with notable colleagues such as Seung-hun Shin and June-Taeg Lee. Together, they have fostered an innovative work environment, leading to the development of advanced technologies that redefine industry standards.

Conclusion

In conclusion, Byung-jun Park exemplifies the spirit of innovation in the realm of integrated circuits and electronic devices. His contributions through patents and collaboration demonstrate his commitment to advancing technology, cementing his reputation as a key player in the electronics industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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