The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2015

Filed:

Sep. 15, 2014
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Sung-kwan Kim, Hwaseong-si, KR;

Doo-won Kwon, Seongnam-si, KR;

Jeong-ki Kim, Seoul, KR;

Wook-hwan Kim, Yongin-si, KR;

Byung-jun Park, Yongin-si, KR;

Seung-hun Shin, Suwon-si, KR;

June-taeg Lee, Suwon-si, KR;

Ha-kyu Choi, Yongin-si, KR;

Tae-seok Oh, Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/00 (2006.01); H01L 27/146 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14643 (2013.01); H01L 24/80 (2013.01); H01L 27/1463 (2013.01); H01L 27/1464 (2013.01); H01L 27/1469 (2013.01); H01L 27/14609 (2013.01); H01L 27/14634 (2013.01); H01L 27/14636 (2013.01); H01L 27/14687 (2013.01); H01L 27/14689 (2013.01); H01L 27/14621 (2013.01); H01L 27/14627 (2013.01); H01L 2224/05547 (2013.01); H01L 2224/08121 (2013.01); H01L 2224/80895 (2013.01); H01L 2224/80896 (2013.01);
Abstract

An electronic device may include a first semiconductor layer, a first electrode layer on the semiconductor layer, an adhesive insulating layer on the first electrode layer, a second electrode layer on the adhesive insulating layer, a second semiconductor layer. The first electrode layer may include a first plurality of electrodes, the first electrode layer may be between the adhesive insulating layer and the first semiconductor layer, and the adhesive insulating layer may include at least one of SiOCN, SiBN, and/or BN. The second electrode layer may include a second plurality of electrodes, the adhesive insulating layer may be between the first and second electrode layers, and the second electrode layer may be between the adhesive insulating layer and the second semiconductor layer.


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