Company Filing History:
Years Active: 2013-2018
Title: Byung-Iyul Park: Innovator in Semiconductor Packaging Technologies
Introduction
Byung-Iyul Park is a prominent inventor based in Seoul, South Korea. With a remarkable portfolio of six patents, his contributions to the field of semiconductor technology are noteworthy. Working at Samsung Electronics Co., Ltd., Park has made significant advancements in packaging solutions that enhance device performance and efficiency.
Latest Patents
Park's latest patents showcase innovative approaches to semiconductor packaging. One of his key inventions is the "Fan out wafer level package type semiconductor package and package on package type semiconductor package including the same." This advanced package includes a lower section featuring a printed circuit board (PCB) substrate with a cavity that accommodates a semiconductor chip. The design integrates a redistribution structure for improved connectivity, providing a robust solution for modern electronic devices.
Another notable patent is focused on "Integrated circuit devices having through-silicon vias and methods of manufacturing such devices." This invention involves a semiconductor structure enhanced by a through-silicon-via (TSV) structure for efficient interconnections. The integration of a specialized metal capping layer demonstrates Park's commitment to improving the reliability and performance of integrated circuits.
Career Highlights
Throughout his career, Byung-Iyul Park has established himself as a key figure in the semiconductor industry. His work at Samsung Electronics Co., Ltd. has placed him at the forefront of innovation, particularly in the development of semiconductor packaging technologies. His six patents illustrate his ongoing dedication to enhancing product performance and addressing industry challenges.
Collaborations
Park collaborates closely with esteemed colleagues, including Gil-heyun Choi and Hyung-Jun Jeon. Together, they contribute to groundbreaking research and development projects that push the boundaries of semiconductor technology. These collaborations highlight the importance of teamwork in driving innovative solutions.
Conclusion
Byung-Iyul Park stands out as an influential inventor in the semiconductor sector. His portfolio of patents, including advanced packaging methodologies and integrated circuit innovations, reflects his commitment to technological advancement. As the industry continues to evolve, Park's contributions will undoubtedly play a vital role in shaping the future of electronic devices.