Byung-Hyug Roh

Title: The Innovative Mind of Byung-Hyug Roh

Introduction

Byung-Hyug Roh is a remarkable inventor based in Yongin-si, South Korea, known for his contributions to the field of semiconductor packaging. With a total of seven patents to his name, he has made significant strides in innovative technology, particularly through his work at Samsung Electronics Co., Ltd.

Latest Patents

One of Byung-Hyug Roh's latest contributions is the patent for a chip-stacked semiconductor package and method of manufacturing the same. This innovation includes a first chip with a specific front and back surface, along with a connection member located on the front surface. The package also features a second chip with a second connection member and a through-silicon via (TSV) that is electrically connected to it. The invention emphasizes an efficient design where a first sealing member is positioned between the two chips, ensuring the first and second connection members remain symmetric relative to each other. This advancement highlights a significant step forward in semiconductor technology, making packaging more efficient and streamlined.

Career Highlights

Byung-Hyug Roh’s career at Samsung Electronics Co., Ltd. has been marked by his focus on semiconductor innovations. His ability to create practical solutions for complex challenges in chip design demonstrates his expertise and dedication to advancing technology. His patents reflect a thorough understanding of the interplay between various components in semiconductor packaging.

Collaborations

Roh has collaborated with notable colleagues, including Un-Byoung Kang and Tae-Je Cho, who have complemented his efforts in various projects. These collaborations have fostered a creative environment that has led to several breakthroughs in semiconductor design and manufacturing.

Conclusion

Byung-Hyug Roh stands out as a brilliant inventor within the tech industry. His innovative patents, particularly in chip-stacked semiconductor technology, exemplify his commitment to advancing electronic manufacturing. His collaborations with talented coworkers further enhance the impact of his work, making him a key figure in the semiconductor domain at Samsung Electronics Co., Ltd.