Enter inventor name

Brown Cornelius Peethala

USPTO Granted Patents = 15 (Patent Applications = 2)

Average Co-Inventor Count = 4.4

ph-index = 5

Forward Citations = 122(Granted Patents)

Location History:

Albany, NY (US) (2015 - 2021)
Slingerlands, NY (US) (2019 - 2021)

Company Filing History:

14 out of 164,197

International Business Machines Corporation

Stmicroelectronics Gmbh

patents

where one patent can have more than one assignee

Years Active: 2015-2021

Loading Chart...

15 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 10957588 - Chamferless via structures (2021-03-23),

2. 10937694 - Chamferless via structures (2021-03-02),

3. 10903118 - Chamferless via structures (2021-01-26),

4. 10658176 - Methods of mitigating cobalt diffusion in contact structures and the resulting devices (2020-05-19),

5. 10388565 - Chamferless via structures (2019-08-20),

6. 10032668 - Chamferless via structures (2018-07-24),

7. 9934980 - Rework and stripping of complex patterning layers using chemical mechanical polishing (2018-04-03),

8. 9799559 - Methods employing sacrificial barrier layer for protection of vias during trench formation (2017-10-24),

9. 9613862 - Chamferless via structures (2017-04-04),

10. 9508560 - SiARC removal with plasma etch and fluorinated wet chemical solution combination (2016-11-29),

11. 9390967 - Method for residue-free block pattern transfer onto metal interconnects for air gap formation (2016-07-12),

12. 9378966 - Selective etching of silicon wafer (2016-06-28),

13. 9373543 - Forming interconnect features with reduced sidewall tapering (2016-06-21),

14. 9349687 - Advanced manganese/manganese nitride cap/etch mask for air gap formation scheme in nanocopper low-K interconnect (2016-05-24),

15. 9190285 - Rework and stripping of complex patterning layers using chemical mechanical polishing (2015-11-17),

Title: Innovator Spotlight: Brown Cornelius Peethala - Pioneering Chamferless Via Structures

Introduction:

Brown Cornelius Peethala, a prolific inventor based in Albany, NY, has made significant contributions to the field of semiconductor manufacturing. With a total of 15 patents to his name, Peethala's innovative work has revolutionized the production of chamferless via structures in electronic devices.

Latest Patents:

Peethala's latest patents focus on chamferless via structures and methods of manufacture. These cutting-edge methods involve the formation of self-aligned vias within dielectric material, plugging them with specialized material, utilizing protective sacrificial masks during trench formation, and ultimately filling the vias with conductive material. His meticulous approach ensures enhanced wiring via integrity and conductivity.

Career Highlights:

Having worked with esteemed companies such as IBM (International Business Machines Corporation) and Globalfoundries Inc., Peethala has honed his expertise in semiconductor technology. His tenure at these industry giants has provided him with a platform to innovate and drive forward advancements in manufacturing processes.

Collaborations:

Throughout his career, Peethala has collaborated with skilled professionals in the field. Notable coworkers include Shariq Siddiqui and Frank Wilhelm Mont, with whom he has shared knowledge and expertise to further refine semiconductor manufacturing techniques.

Conclusion:

Brown Cornelius Peethala's groundbreaking work in chamferless via structures underscores his commitment to pushing the boundaries of innovation in the semiconductor industry. His patented methods stand as a testament to his technical acumen and dedication to advancing electronic device manufacturing. Peethala's legacy as a visionary inventor continues to inspire future generations in the field of semiconductor technology.

This text is generated by artificial intelligence and may not be accurate.

Please report any incorrect information to support@idiyas.com