Bridger Earl Hoerner

Title: Bridger Earl Hoerner: Innovator in Substrate Temperature Control

Introduction

Bridger Earl Hoerner is an accomplished inventor based in Columbia Falls, Montana, with a noteworthy portfolio that includes four patents. His innovative contributions primarily focus on enhancing the processes involved in substrate temperature control, particularly in the field of materials deposition.

Latest Patents

Among his latest inventions, Bridger developed several methodologies and apparatuses aimed at improving aluminum film morphology. These include a patent for a programmable electrostatic chuck designed to control substrate temperature through the monitoring of temperatures across multiple zones. This system includes features for fluid control in separate channels corresponding to each zone, thus allowing for precise thermal management during material deposition from a sputtering target. Another patent closely related to this concept focuses on a programmable ESC that employs independent heating elements to manage temperatures effectively, ensuring optimal results in aluminum film morphology.

Career Highlights

Bridger Earl Hoerner is associated with Applied Materials, Inc., a leading company in materials engineering. His career at the company has been marked by significant advancements in substrate temperature control technologies, reinforcing the efficiency and effectiveness of the deposition processes within the semiconductor industry.

Collaborations

Throughout his career, Bridger has collaborated with talented colleagues, including Yaoying Zhong and Siew Kit Hoi. These collaborations have played a crucial role in the development of his innovative patents, showcasing the importance of teamwork in driving technological advancements.

Conclusion

Bridger Earl Hoerner’s contributions to the field of materials engineering highlight his inventive spirit and dedication to enhancing the technological landscape. With his robust portfolio of patents, he continues to make an impact on the industry, paving the way for future innovations in substrate temperature control.