The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 06, 2019
Filed:
Dec. 22, 2017
Applied Materials, Inc., Santa Clara, CA (US);
Paul McHugh, Kalispell, MT (US);
Bridger Hoerner, Kalispell, MT (US);
Marvin Bernt, Kalispell, MT (US);
Thomas H. Oberlitner, Kalispell, MT (US);
Brian Aegerter, Kalispell, MT (US);
Richard W. Plavidal, Kalispell, MT (US);
Andrew Anten, Kalispell, MT (US);
Adam McClure, Kalispell, MT (US);
Randy Harris, Kalispell, MT (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
Methods of wetting a semiconductor substrate may include forming a controlled atmosphere in a processing chamber housing the semiconductor substrate. The semiconductor substrate may define a plurality of features, which may include vias. The methods may include flowing a wetting agent into the processing chamber. A chamber pressure may be maintained below about 100 kPa. The methods may also include wetting the plurality of features defined in the substrate.