Redwood City, CA, United States of America

Brian Lee Bircumshaw

This inventor holds 32 USPTO granted patents and 16 published patent applications and 14 EPO patents, primarily in Ultrasonic Imaging. Top assignees: Exo Imaging, Inc., Fairchild Semiconductor Corporation. Active years: 2016-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Brian Lee Bircumshaw. Retrieved from https://idiyas.com/inventor/brian-lee-bircumshaw

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 32 (Patent Applications = 16)

% Patents Active = 100.0

EPO Patents = 14 (Patent Applications = 20)

Average Co-Inventor Count = 3.1

ph-index = 5

Forward Citations = 101(Granted Patents)

Location History:

Orinda, CA (US) (2023)
Oakland, CA (US) (2016 - 2024)
Redwood City, CA (US) (2022 - 2024)

Company Filing History:

Fairchild Semiconductor Corporation

patents

Years Active: 2016-2026

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Areas of Expertise:

Ultrasonic Imaging

Micromachined Transducers

Piezoelectric Devices

Configurable Imager

Acoustic Absorber

Thermocompression Bonding

Eutectic Bonding

Solder Bonding

Handheld Imager

MUT Coupling Efficiency

Hybrid Contacts

Thin Film Devices

32 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12704626 - Integration techniques for micromachined pMUT arrays and electronics using solid liquid interdiffusion (SLID) (2026-08-11),

2. 12704613 - Processing circuitry, system and method to test pixels in an ultrasonic imaging device based on comparing a baseline pixel performance dataset with a current pixel performance dataset (2026-08-11),

3. 12636680 - Imaging devices having piezoelectric transceivers with harmonic characteristics (2026-05-26),

4. 12533711 - Dual and multiple membrane micromachined ultrasound transducers (2026-01-27),

5. 12490655 - Configurable ultrasonic imager (2025-12-02),

6. 12486159 - Micro-machined ultrasound transducers with insulation layer and methods of manufacture (2025-12-02),

7. 12289999 - High density multi-poled thin film piezoelectric devices and methods of making the same (2025-04-29),

8. 12274174 - Systems and methods for integrating ultrasonic transducers with hybrid contacts (2025-04-08),

9. 12263507 - Integration techniques for micromachined pMUT arrays and electronics using thermocompression bonding, eutectic bonding, and solder bonding (2025-04-01),

10. 12213834 - Ultrasound transducer with acoustic absorber structure (2025-02-04),

11. 12172189 - Integration techniques for micromachined pMUT arrays and electronics using thermocompression bonding, eutectic bonding, and solder bonding (2024-12-24),

12. 12059708 - Ultrasonic transducers with Q spoiling (2024-08-13),

13. 12059300 - Handheld ultrasound imager (2024-08-13),

14. 12019155 - Ultrasonic imaging device with programmable anatomy and flow imaging (2024-06-25),

15. 12000728 - Asymmetrical ultrasound transducer array (2024-06-04),

Title: Brian Lee Bircumshaw: Innovator in Ultrasound Technology

Introduction

Brian Lee Bircumshaw is a renowned inventor based in Redwood City, CA, with an impressive portfolio of 23 patents to his name. His work largely focuses on advancements in ultrasound technology, particularly in the design and integration of transducers.

Latest Patents

Bircumshaw's latest patents showcase his innovative approach to ultrasound transducer development. One notable patent titled "Ultrasound transducer with acoustic absorber structure" describes novel acoustic absorber materials characterized by high acoustic attenuation and thermal conductivity. This invention incorporates an inorganic, porous foam and an absorbing material within the foam's pores, demonstrating a significant advancement in ultrasound transducer efficiency.

Another key patent is "Integration techniques for micromachined pMUT arrays and electronics using thermocompression bonding, eutectic bonding, and solder bonding." This patent outlines methods for integrating piezoelectric micromachined ultrasonic transducer (pMUT) arrays with application-specific integrated circuits (ASICs) through various bonding techniques. The innovation allows for a device design where both substrates can be physically bonded while ensuring that any individual pMUT within the array remains addressable.

Career Highlights

Throughout his career, Brian Lee Bircumshaw has worked with leading companies such as Exo Imaging, Inc. and Fairchild Semiconductor Corporation. His tenure at these organizations has allowed him to refine his skills and push the boundaries of ultrasound technology.

Collaborations

Bircumshaw has collaborated with notable professionals in the field, including Sandeep Akkaraju and Haesung Kwon. These collaborations have contributed to the advancement of technology within the realms of ultrasound imaging and transducer development.

Conclusion

Brian Lee Bircumshaw’s contributions to the field of ultrasound technology are significant and impactful. His innovative patents and collaborations highlight his role as a leading inventor, consistently advancing the technology used in various applications. With continued dedication to research and development, Bircumshaw undoubtedly plays a vital role in shaping the future of ultrasound technology.

Profile summary based on public USPTO records.