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For the Inventor, By the Inventor

Erie, CO, United States of America

Brian C Gaide

USPTO Granted Patents = 61 

 

Average Co-Inventor Count = 2.1

ph-index = 12

Forward Citations = 470(Granted Patents)

Forward Citations (Not Self Cited) = 418(Oct 12, 2025)


Inventors with similar research interests:


Location History:

  • Longmont, CO (US) (2014 - 2015)
  • Glassboro, NJ (US) (2010 - 2016)
  • Eire, CO (US) (2021)
  • Erie, CO (US) (2014 - 2024)

Company Filing History:

goldMedal60 out of 5,002 
 
Xilinx, Inc.
 patents
silverMedal1 out of 832,680 
Other
 patents

Years Active: 2010-2025

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61 patents (USPTO):
1. 12430275 - Methods to extend NoC interconnect across multiple dice in 3D (2025-09-30),
2. 12271332 - Redundancy scheme for activating circuitry on a base die of a 3D stacked device (2025-04-08),
3. 12261603 - Adaptive integrated programmable device platform (2025-03-25),
4. 12235671 - Adding soft logic to flush a pipeline and reduce current ramp (2025-02-25),
5. 12154617 - Yield recovery scheme for memory (2024-11-26),
6. 12093394 - System and method for secure deconstruction sensor in a heterogeneous integration circuitry (2024-09-17),
7. 11961823 - Forming and/or configuring stacked dies (2024-04-16),
8. 11901300 - Universal interposer for a semiconductor package (2024-02-13),
9. 11868174 - Clock tree routing in a chip stack (2024-01-09),
10. 11750195 - Compute dataflow architecture (2023-09-05),
11. 11683038 - Adaptive integrated programmable device platform (2023-06-20),
12. 11451230 - Compute dataflow architecture (2022-09-20),
13. 11270977 - Power delivery network for active-on-active stacked integrated circuits (2022-03-08),
14. 11239203 - Multi-chip stacked devices (2022-02-01),
15. 11063594 - Adaptive integrated programmable device platform (2021-07-13),

Title: The Innovative Contributions of Brian C. Gaide

Introduction: Brian C. Gaide, based in Erie, Colorado, is an accomplished inventor with an impressive portfolio of 60 patents. His work primarily focuses on advanced semiconductor technologies and system-on-chip designs, reflecting a commitment to innovation in the field of electronics.

Latest Patents: Among his most recent inventions are two noteworthy patents. The first, titled "Redundancy Scheme for Activating Circuitry on a Base Die of a 3D Stacked Device," describes a 3D stacked device configuration consisting of multiple semiconductor chips. This innovation enhances functionality by creating a system where non-functional blocks on a chip can be bypassed through inter-block bridges, thereby allowing for data routing and processing continuity. The second patent, "Adaptive Integrated Programmable Device Platform," introduces a system-on-chip that comprises a grid of data processing engines. This design allows different partitions to implement applications independently, showcasing Gaide's strategic approach to flexible and scalable processing solutions.

Career Highlights: Throughout his career, Brian C. Gaide has made significant contributions to the tech industry, particularly during his tenure at Xilinx, Inc. There, he leveraged his expertise to develop cutting-edge technologies that address modern challenges in semiconductor designs and applications.

Collaborations: Gaide has worked alongside notable professionals in the tech industry, including Steven P. Young and Sagheer Ahmad. These collaborations have enabled a cross-pollination of ideas that have contributed to the advancement of their respective fields.

Conclusion: Brian C. Gaide's innovative spirit and dedication to invention have led to substantial advancements in semiconductor technology. With a remarkable number of patents, he continues to shape the future of electronics and inspire future inventors in the industry. His work exemplifies the essence of innovation, emphasizing the importance of adaptability and functionality in modern technology.

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