The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 23, 2025

Filed:

Jun. 28, 2023
Applicant:

Xilinx, Inc., San Jose, CA (US);

Inventors:

Brian C. Gaide, Erie, CO (US);

Sneha Bhalchandra Date, San Jose, CA (US);

Juan J. Noguera Serra, San Jose, CA (US);

Assignee:

XILINX, INC., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 15/80 (2006.01); H03K 19/177 (2020.01); H03K 19/17736 (2020.01);
U.S. Cl.
CPC ...
G06F 15/803 (2013.01);
Abstract

Examples herein describe a three-dimensional (3D) die stack. The 3D die stack includes a programmable logic (PL) die and a compute die stacked on top of the PL die. The PL die includes a plurality of configurable blocks and a plurality of first electrical connections on a top side of the PL die. The compute die includes a plurality of data processing engines and a plurality of second electrical connections on a bottom side of the compute die. The three-dimensional die stack includes a plurality of tiles, each tile comprising M configurable blocks included in the plurality of configurable blocks and N data processing engines included in the plurality of data processing engines.


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