The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 2026

Filed:

May. 18, 2023
Applicant:

Xilinx, Inc., San Jose, CA (US);

Inventors:

Brian C. Gaide, Erie, CO (US);

Sagheer Ahmad, Cupertino, CA (US);

Aman Gupta, Sunnyvale, CA (US);

Assignee:

XILINX, INC., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 70/65 (2026.01); H10B 80/00 (2026.01); H10W 70/60 (2026.01); H10W 90/00 (2026.01); H10W 90/20 (2026.01);
U.S. Cl.
CPC ...
H10W 70/65 (2026.01); H10B 80/00 (2023.02); H10W 70/611 (2026.01); H10W 90/00 (2026.01); H10W 90/297 (2026.01);
Abstract

Embodiments herein describe a memory controller (MC) in a first integrated circuit (IC) that connect to circuitry in the same integrated circuit (e.g., horizontal direction) and to circuitry in a second IC in the vertical direction. That is, the first and second ICs can be stacked on each other where the MC in the first IC provides an interface for both circuitry in the first IC as well as circuitry in the second IC to communicate with a separate memory device. Thus, the MC includes data paths in both the X direction (e.g., within the same IC) and the Y direction (e.g., to an external IC). In this manner, the MC can provide an interface for circuitry in multiple ICs (or dies or chiplets) to the same external memory device.


Find Patent Forward Citations

Loading…