The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 08, 2025

Filed:

Mar. 30, 2023
Applicant:

Xilinx, Inc., San Jose, CA (US);

Inventor:

Brian C. Gaide, Erie, CO (US);

Assignee:

XILINX, INC., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 13/40 (2006.01); H01L 25/065 (2023.01); H10B 80/00 (2023.01);
U.S. Cl.
CPC ...
G06F 13/4027 (2013.01); H01L 25/0657 (2013.01); H10B 80/00 (2023.02); H01L 2225/06565 (2013.01);
Abstract

A 3D stacked device includes a plurality of semiconductor chips stacked in a vertical direction. The semiconductor chips each include a plurality of portions grouped into slivers according to the column they lie in. Each of the portions further includes a plurality of blocks grouped into sub-slivers and interconnected by inter-block bridges. A block that must be functional on the bottommost chip of the 3D stacked device is configured to bypass a neighboring nonfunctional block on the same chip by using a communication path of an inter-block bridge to a neighboring functional block that is in the same sub-sliver as the nonfunctional block but in a different chip. So long as only one of the blocks in a sub-sliver is nonfunctional, the inter-block bridges permit the other blocks in the sub-sliver to receive and route data.


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