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For the Inventor, By the Inventor

Chandler, AZ, United States of America

Bora Baloglu

This inventor holds 28 USPTO granted patents and 5 published patent applications, primarily in Semiconductor Manufacturing. Top assignees: Amkor Technology, Inc., Amkor Technology Singapore Holding Pte. Ltd., Amkor Technology Portugal, S.a.. Active years: 2015-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Bora Baloglu. Retrieved from https://idiyas.com/inventor/bora-baloglu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 28 

% Patents Active = 92.9

Average Co-Inventor Count = 2.7

ph-index = 5

Forward Citations = 64(Granted Patents)


Location History:

  • Oporto, PT (2022 - 2023)
  • Chandler, AZ (US) (2015 - 2024)

Company Filing History:

goldMedal17 out of 1,009 
 
Amkor Technology, Inc.
 patents
silverMedal11 out of 329 
 
Amkor Technology Singapore Holding Pte. Ltd.
 patents
bronzeMedal1 out of 2 
 
Amkor Technology Portugal, S.a.
 patents
where one patent can have more than one assignee

Years Active: 2015-2026

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Areas of Expertise:
Semiconductor Device
Manufacturing Method
Interlocking Bonds
Heat Distribution
Vibration Management
Through-Silicon Vias
Electronic Package
Warpage Control
Molded Structure
Die Seal Design
Hybrid Panel
28 patents (USPTO):Explore Patents
1. 12696789 - Method of manufacturing an electronic device and electronic device manufactured thereby (2026-07-28),
2. 12581970 - Semiconductor device and manufacturing method thereof (2026-03-17),
3. 12015000 - Semiconductor product with interlocking metal-to-metal bonds and method for manufacturing thereof (2024-06-18),
4. 11901343 - Semiconductor device with integrated heat distribution and manufacturing method thereof (2024-02-13),
5. 11823913 - Method of manufacturing an electronic device and electronic device manufactured thereby (2023-11-21),
6. 11605552 - Hybrid panel method of manufacturing electronic devices and electronic devices manufactured thereby (2023-03-14),
7. 11444013 - Semiconductor device and manufacturing method thereof (2022-09-13),
8. 11352252 - Semiconductor device and method of manufacturing semiconductor device (2022-06-07),
9. 11031259 - Method of manufacturing an electronic device and electronic device manufactured thereby (2021-06-08),
10. 11018102 - Semiconductor product with interlocking metal-to-metal bonds and method for manufacturing thereof (2021-05-25),
11. 10985146 - Semiconductor device with integrated heat distribution and manufacturing method thereof (2021-04-20),
12. 10861798 - Embedded vibration management system having an array of vibration absorbing structures (2020-12-08),
13. 10790161 - Electronic device with adaptive vertical interconnect and fabricating method thereof (2020-09-29),
14. 10504827 - Semiconductor device and manufacturing method thereof (2019-12-10),
15. 10468272 - Method of manufacturing an electronic device and electronic device manufactured thereby (2019-11-05),

Title: Bora Baloglu: Innovator and Patent Holder in Semiconductor Technology

Introduction

Bora Baloglu is an accomplished inventor based in Chandler, AZ, known for his significant contributions to the field of semiconductor technology. With a remarkable portfolio of 26 patents, Bora has demonstrated a commitment to advancing innovations in electrical devices and packaging.

Latest Patents

Among his latest innovations, Bora holds patents for a "Semiconductor product with interlocking metal-to-metal bonds and method for manufacturing thereof." This invention presents a structure and method designed to enhance metal-to-metal bonding in electrical devices through an innovative interlocking mechanism. Furthermore, he has developed a "Semiconductor device with integrated heat distribution and manufacturing method thereof," which addresses heat management in semiconductor packages. This invention includes a first semiconductor device and a second stacked device, accompanied by an external heat distribution layer, ensuring efficient thermal management.

Career Highlights

Bora has worked with notable companies such as Amkor Technology, Inc. and Amkor Technology Singapore Holding Pte. Ltd. His tenure at these organizations has allowed him to gain extensive experience in semiconductor manufacturing and design, contributing to the development of cutting-edge technologies.

Collaborations

Throughout his career, Bora has collaborated with talented professionals like Curtis Michael Zwenger and Ron Huemoeller. These partnerships have fostered a creative environment that promotes innovation and elevates the semiconductor industry.

Conclusion

Bora Baloglu's contributions to semiconductor technology are marked by his numerous patents and collaborative efforts. His innovative solutions, particularly in metal-to-metal bonding and heat distribution, underscore his role as a leading inventor in the field. As technology continues to evolve, Bora's work will likely play a significant part in shaping the future of semiconductor devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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