The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 13, 2022
Filed:
Dec. 09, 2019
Applicant:
Amkor Technology Singapore Holding Pte. Ltd., Valley Point, SG;
Inventors:
Bora Baloglu, Chandler, AZ (US);
Ron Huemoeller, Gilbert, AZ (US);
Curtis Zwenger, Chandler, AZ (US);
Assignee:
Amkor Technology Singapore Holding Pte. Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 23/16 (2006.01); H01L 21/56 (2006.01); H01L 21/48 (2006.01); H01L 21/78 (2006.01); H01L 23/18 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/561 (2013.01); H01L 21/565 (2013.01); H01L 21/78 (2013.01); H01L 23/16 (2013.01); H01L 23/18 (2013.01); H01L 23/3114 (2013.01); H01L 23/49811 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 24/19 (2013.01); H01L 24/96 (2013.01); H01L 21/568 (2013.01); H01L 23/3128 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/94 (2013.01); H01L 2224/97 (2013.01); H01L 2924/1815 (2013.01); H01L 2924/351 (2013.01);
Abstract
An electronic device and a method of manufacturing an electronic device. As non-limiting examples, various aspects of this disclosure provide various methods of manufacturing electronic devices, and electronic devices manufactured thereby, that comprise utilizing metal studs to further set a semiconductor die into the encapsulant.