The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 14, 2023

Filed:

Feb. 02, 2021
Applicants:

Amkor Technology Singapore Holding Pte. Ltd., Singapore, SG;

Amkor Technology Portugal, S.a., Vila do Conde, PT;

Inventors:

Bora Baloglu, Oporto, PT;

Suresh Jayaraman, Gilbert, AZ (US);

Ronald Huemoeller, Gilbert, AZ (US);

Andre Cardoso, Oporto, PT;

Eoin O'Toole, Oporto, PT;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/683 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6836 (2013.01); H01L 24/03 (2013.01); H01L 21/561 (2013.01); H01L 21/568 (2013.01); H01L 2221/68359 (2013.01); H01L 2221/68372 (2013.01); H01L 2221/68381 (2013.01); H01L 2224/0231 (2013.01); H01L 2224/02379 (2013.01); H01L 2224/02381 (2013.01); H01L 2224/0401 (2013.01);
Abstract

A hybrid panel method of (and apparatus for) manufacturing electronic devices, and electronic devices manufactured thereby. As non-limiting examples, various aspects of this disclosure provide a method of manufacturing an electronic device, where the method comprises mounting a plurality of subpanels to a panel, processing the subpanels as a panel, and removing the plurality of subpanels from the panel.


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