Bo-Chang Su

Title: Bo-Chang Su: Innovator in Semiconductor Technology

Introduction: Bo-Chang Su, a notable inventor based in Tainan, Taiwan, has made significant contributions to the field of semiconductor technology. With a total of five patents to his name, Su is recognized for his innovative approaches to semiconductor device structures and methods, which enhance performance and reliability in electronic applications.

Latest Patents: Among his latest patents, Su developed a semiconductor device that includes a deep trench isolation (DTI) structure comprising a dielectric structure and a copper structure. This innovation significantly improves the integrity of semiconductor devices. Additionally, he introduced a method for creating deep trench isolation structures that are resistant to cracking. This process involves etching a semiconductor substrate, filling it with a dielectric layer, and forming a high-reflectivity metal layer, which enhances device durability and efficiency.

Career Highlights: Bo-Chang Su is affiliated with Taiwan Semiconductor Manufacturing Company Limited, a leading organization in the semiconductor industry. His expertise has been instrumental in advancing the company's R&D efforts, contributing to the efficiency and effectiveness of semiconductor manufacturing processes.

Collaborations: Throughout his career, Su has collaborated with notable colleagues, including Chih-Ho Tai and Yu-Lung Yeh. Their combined efforts have further propelled advancements in semiconductor technologies and innovative solutions in the industry.

Conclusion: Bo-Chang Su remains an influential figure in the semiconductor landscape, with a firm commitment to innovation and excellence. His recent patents and collaborative work contribute significantly to the evolution of semiconductor technologies, underlining his role as a key inventor in this dynamic field.