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For the Inventor, By the Inventor

Gilbert, AZ, United States of America

Blake A Gillett

USPTO Granted Patents = 9

Average Co-Inventor Count = 2.7

ph-index = 8

Forward Citations = 200(Granted Patents)


Company Filing History:

goldMedal9 out of 1,009 
 
Amkor Technology, Inc.
 patents

Years Active: 2002-2006

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9 patents (USPTO):Explore Patents
1. 7001799 - Method of making a leadframe for semiconductor devices (2006-02-21),
2. 6844615 - Leadframe package for semiconductor devices (2005-01-18),
3. 6794740 - Leadframe package for semiconductor devices (2004-09-21),
4. 6756658 - Making two lead surface mounting high power microleadframe semiconductor packages (2004-06-29),
5. 6723582 - Method of making a semiconductor package having exposed metal strap (2004-04-20),
6. 6707138 - Semiconductor device including metal strap electrically coupled between semiconductor die and metal leadframe (2004-03-16),
7. 6566164 - Exposed copper strap in a semiconductor package (2003-05-20),
8. 6521982 - Packaging high power integrated circuit devices (2003-02-18),
9. 6459147 - Attaching semiconductor dies to substrates with conductive straps (2002-10-01),

Title: Blake A. Gillett: Innovator in Semiconductor Technology

Introduction

Blake A. Gillett is a prominent inventor based in Gilbert, AZ (US), known for his contributions to semiconductor technology. With a total of 9 patents to his name, Gillett has made significant advancements in the design and manufacturing of semiconductor packages.

Latest Patents

Gillett's latest patents include innovative methods for creating leadframes for semiconductor devices. One notable patent describes a semiconductor package that features a leadframe with a die paddle containing an opening. This design includes a plurality of leads, with at least one lead positioned in spaced relation to the die paddle. The remaining leads are attached to the die paddle and extend outward. The source terminal of a semiconductor die is electrically connected to the die paddle, which also has a gate terminal and a drain terminal. The gate terminal connects to the lead that is spaced from the die paddle. The package body encapsulates the die paddle, leads, and semiconductor die, ensuring that portions of the leads and the drain terminal remain exposed.

Another patent focuses on a leadframe package for semiconductor devices, reiterating the innovative structure of the leadframe and its components. This design enhances the functionality and efficiency of semiconductor packages, showcasing Gillett's expertise in the field.

Career Highlights

Blake A. Gillett is currently employed at Amkor Technology, Inc., where he continues to develop cutting-edge semiconductor solutions. His work has significantly impacted the industry, leading to advancements that improve the performance and reliability of semiconductor devices.

Collaborations

Gillett has collaborated with notable coworkers, including Sean Timothy Crowley and Keith M. Edwards, contributing to a dynamic team focused on innovation in semiconductor technology.

Conclusion

Blake A. Gillett's contributions to semiconductor technology through his patents and work at Amkor Technology, Inc. highlight his role as a key innovator in the field. His advancements continue to shape the future of semiconductor devices, making a lasting impact on the industry.

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