The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 16, 2004

Filed:

Sep. 26, 2002
Applicant:
Inventors:

Sean T. Crowley, Phoenix, AZ (US);

Blake A. Gillett, Gilbert, AZ (US);

Bradley D. Boland, Mesa, AZ (US);

Philip S. Mauri, Cabuyao, PH;

Ferdinand E. Belmonte, Laguna, PH;

Remigio V. Burro, Jr., San Pedro, PH;

Victor M. Aquino, Jr., Marikina, PH;

Assignee:

Amkor Technology, Inc., Chandler, AZ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/348 ; H01L 2/352 ; H01L 2/334 ; H01L 2/3495 ; H05K 7/20 ;
U.S. Cl.
CPC ...
H01L 2/348 ; H01L 2/352 ; H01L 2/334 ; H01L 2/3495 ; H05K 7/20 ;
Abstract

A semiconductor device is disclosed that includes a semiconductor die, a metal leadframe, and a metal strap. A bottom surface of the semiconductor device is on and electrically coupled to a first portion of the leadframe. A first end portion of the metal strap is on and electrically coupled to a top surface of the semiconductor die. An opposite, second end portion of the metal strap is on and electrically coupled to a second portion of the leadframe within a recess of the second portion of the leadframe.


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