The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 29, 2004
Filed:
Apr. 06, 2001
Blake A. Gillett, Gilbert, AZ (US);
Sean T. Crowley, Phoenix, AZ (US);
Bradley D. Boland, Gilbert, AZ (US);
Keith M. Edwards, Phoenix, AZ (US);
Amkor Technology, Inc., Chandler, AZ (US);
Abstract
A two-lead, surface-mounting, high-power micro-leadframe semiconductor package has the same outline, mounting, and electrical functionality as industry standard leadframe packages but provides a lower internal resistance, a higher package power rating, and costs less to produce. The novel package incorporates one of a rectangular array of “micro-leadframes” (“MLFs”), each having parallel and respectively coplanar upper and lower surfaces etched in a plate having a uniform thickness. Each micro-leadframe includes an I-shaped die pad having a head, a foot, and opposite sides. First and second leads are disposed at the foot of the die pad, each having a side aligned with one of the sides of the pad. The second lead has an right-angled wire-bonding pad next to the die pad. A portion of a lower surface of each of the die pad and the leads is exposed through a lower surface of an envelope of plastic molded on the package to define package input/output terminals.