logo

For the Inventor, By the Inventor

Folsom, CA, United States of America

Bilal Khalaf

This inventor holds 22 USPTO granted patents and 4 published patent applications. Top assignees: Intel Corporation, Sk Hynix Nand Product Solutions Corp., Solidigm Inc.. Active years: 2017-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Bilal Khalaf. Retrieved from https://idiyas.com/inventor/bilal-khalaf

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 22 

% Patents Active = 86.4

Average Co-Inventor Count = 2.1

ph-index = 2

Forward Citations = 24(Granted Patents)


Company Filing History:

goldMedal20 out of 56,290 
 
Intel Corporation
 patents
silverMedal1 out of 137 
 
Sk Hynix Nand Product Solutions Corp.
 patents
bronzeMedal1 out of 4 
 
Solidigm Inc.
 patents

Years Active: 2017-2026

Loading Chart...
22 patents (USPTO):Explore Patents
1. 12745592 - Methods and systems for controlling underfill bleed-out in semiconductor packaging (2026-09-22),
2. 12733100 - Reducing printed circuit board area for single-sided printed circuit board (2026-09-08),
3. 11894334 - Dual head capillary design for vertical wire bond (2024-02-06),
4. 11848311 - Microelectronic packages having a die stack and a device within the footprint of the die stack (2023-12-19),
5. 11817438 - System in package with interconnected modules (2023-11-14),
6. 11811182 - Solderless BGA interconnect (2023-11-07),
7. 11710674 - Embedded component and methods of making the same (2023-07-25),
8. 11700696 - Buried electrical debug access port (2023-07-11),
9. 11373974 - Electronic device packages and methods for maximizing electrical current to dies and minimizing bond finger size (2022-06-28),
10. 11329027 - Microelectronic packages having a die stack and a device within the footprint of the die stack (2022-05-10),
11. 11315843 - Embedded component and methods of making the same (2022-04-26),
12. 11145632 - High density die package configuration on system boards (2021-10-12),
13. 11064612 - Buried electrical debug access port (2021-07-13),
14. 10879152 - Through mold via (TMV) using stacked modular mold rings (2020-12-29),
15. 10847450 - Compact wirebonding in stacked-chip system in package, and methods of making same (2020-11-24),

Title: The Innovative Mind of Bilal Khalaf

Introduction: Bilal Khalaf, a talented inventor based in Folsom, CA (US), is known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Bilal Khalaf holds several patents in the areas of renewable energy technologies, artificial intelligence, and sustainable urban development. His most recent patent involves a revolutionary method for optimizing solar panel efficiency through advanced tracking systems.

Career Highlights: With a background in engineering and a passion for sustainability, Bilal Khalaf has dedicated his career to developing cutting-edge solutions that address pressing global challenges. His work has been recognized for its ingenuity and practicality, earning him prestigious awards in the industry.

Collaborations: Bilal Khalaf has collaborated with leading research institutions, universities, and tech companies to further his innovative projects. His ability to work across disciplines and bring together diverse teams has been instrumental in the success of his inventions.

Conclusion: In conclusion, Bilal Khalaf stands as a visionary inventor whose work continues to push the boundaries of what is possible in the world of technology. His commitment to creating a more sustainable future through innovation serves as an inspiration to aspiring inventors and researchers worldwide.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…