The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2026
Filed:
Mar. 20, 2023
SK Hynix Nand Product Solutions Corp., Rancho Cordova, CA (US);
Bilal Khalaf, Folsom, CA (US);
SK Hynix NAND Product Solutions Corp., Rancho Cordova, CA (US);
Abstract
This application is directed to controlling underfill bleed-out in semiconductor packaging. A first substrate is disposed on a support substrate, and a bracket structure is placed on the support substrate with a first separation from the first substrate. An underfill material is applied on the support substrate. The bracket structure automatically controls bleed-out of the underfill material. In some embodiments, in accordance with a determination that the underfill material is substantially hardened, the bracket structure is removed from the support substrate. In some embodiments, the first substrate includes a semiconductor package, and the support substrate includes a printed circuit board (PCB). Alternatively, in some embodiments, the first substrate includes a chip, and the support substrate includes a semiconductor package and forms a system in a package (SiP) with the first substrate.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile