The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 07, 2023

Filed:

Oct. 11, 2018
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Tyler Leuten, Orangevale, CA (US);

Mohammed Rahman, Folsom, CA (US);

Bilal Khalaf, Folsom, CA (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 4/58 (2006.01); H01L 23/498 (2006.01); H05K 1/18 (2006.01); H01R 4/04 (2006.01); H01R 4/48 (2006.01); H05K 3/32 (2006.01); H01R 43/027 (2006.01);
U.S. Cl.
CPC ...
H01R 4/58 (2013.01); H01L 23/49816 (2013.01); H01L 23/49866 (2013.01); H01R 4/04 (2013.01); H01R 4/48 (2013.01); H05K 1/181 (2013.01); H05K 3/321 (2013.01); H05K 3/325 (2013.01); H01R 43/027 (2013.01); H05K 2201/10393 (2013.01); H05K 2201/10598 (2013.01); H05K 2201/10734 (2013.01); H05K 2201/10909 (2013.01);
Abstract

Embodiments disclosed herein include electronics packages and methods of forming such packages. In an embodiment, the electronics package comprises a first substrate and a plurality of first conductive pads on the first substrate. In an embodiment, the electronics package further comprises a second substrate and a plurality of second conductive pads on the second substrate. In an embodiment, the electronics package further comprises a plurality of interconnects between the first and second substrate. In an embodiment, each interconnect electrically couples one of the first conductive pads to one of the second conductive pads. In an embodiment, the interconnects comprise strands of conductive material that are woven on themselves to form a mesh-like structure.


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