This inventor holds 3 USPTO granted patents. Top assignee: Freescale Semiconductor,inc.. Active years: 2005-2008.
Company Filing History:
Years Active: 2005-2008
Title: Bennett Joiner: Innovator in Semiconductor Technology
Introduction
Bennett Joiner is a notable inventor based in Austin, TX (US), recognized for his contributions to semiconductor technology. He holds a total of 3 patents, showcasing his innovative approach to enhancing electronic devices.
Latest Patents
Joiner's latest patents include a "Thermally Enhanced Molded Package for Semiconductors," which features an integrated circuit package comprising a substrate, an integrated circuit mounted on the substrate, and a compressive, thermally conductive interposer mounted on the integrated circuit. Another significant patent is for "Electromagnetic Noise Shielding in Semiconductor Packages Using Caged Interconnect Structures." This invention addresses the issue of noise interference in semiconductor devices by utilizing a cage-like structure of shield interconnects to protect sensitive signals from aggressor interconnects.
Career Highlights
Bennett Joiner is currently employed at Freescale Semiconductor, Inc., where he applies his expertise in semiconductor design and innovation. His work has significantly impacted the field, particularly in improving the reliability and performance of electronic components.
Collaborations
Joiner has collaborated with talented coworkers such as Yuan Yuan and Chuchung (Stephen) Lee, contributing to various projects that advance semiconductor technology.
Conclusion
Bennett Joiner's innovative work in semiconductor technology, marked by his patents and collaborations, continues to influence the industry. His contributions are vital in enhancing the performance and reliability of electronic devices.