The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 22, 2008
Filed:
Oct. 27, 2004
Applicants:
Yuan Yuan, Austin, TX (US);
Bennett Joiner, Austin, TX (US);
Chuchung (Stephen) Lee, Round Rock, TX (US);
Inventors:
Yuan Yuan, Austin, TX (US);
Bennett Joiner, Austin, TX (US);
Chuchung (Stephen) Lee, Round Rock, TX (US);
Assignee:
Freescale Semiconductor, Inc., Austin, TX (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01);
U.S. Cl.
CPC ...
Abstract
An integrated circuit package () is provided which comprises a substrate (), an integrated circuit () mounted on the substrate, and a compressive, thermally conductive interposer () mounted on the integrated circuit.