Beng Yeung Ho

Title: The Innovations of Beng Yeung Ho

Introduction

Beng Yeung Ho is a notable inventor based in Singapore, known for his contributions to the field of semiconductor technology. With a total of six patents to his name, he has made significant advancements in the methods of packaging semiconductor devices. His work has had a profound impact on the industry, enhancing the efficiency and reliability of semiconductor packages.

Latest Patents

Beng Yeung Ho's latest patents focus on semiconductor packages and methods of packaging semiconductor devices. These patents disclose innovative methods that include providing a wafer with first and second major surfaces. The wafer is prepared with a plurality of dies and external electrical contacts on the first major surface. The processing of the wafer involves separating it into individual dies, each featuring first and second major surfaces and sidewalls. The external electrical contacts are formed on the first major surface of each die, and an encapsulant material is created to cover portions of the sidewalls.

Career Highlights

Throughout his career, Beng Yeung Ho has worked with prominent organizations such as Utac Headquarters Pte. Ltd. and the Agency for Science, Technology and Research. His experience in these companies has allowed him to refine his skills and contribute to groundbreaking innovations in semiconductor technology.

Collaborations

Beng Yeung Ho has collaborated with talented individuals in his field, including Nathapong Suthiwongsunthorn and Antonio Jr Bambalan Dimaano. These collaborations have fostered a creative environment that has led to the development of advanced semiconductor packaging methods.

Conclusion

Beng Yeung Ho's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the industry. His work continues to shape the future of semiconductor packaging, demonstrating the importance of innovation in technology.