Andreas Huber

This inventor holds 39 USPTO granted patents, primarily in Semiconductor Packaging. Top assignees: International Business Machines Corporation, Globalfoundries Inc.. Active years: 2003-2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Andreas Huber. Retrieved from https://idiyas.com/inventor/andreas-huber-gv92cvwz

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

USPTO Granted Patents = 39

% Patents Active = 38.5

Average Co-Inventor Count = 5.2

ph-index = 7

Forward Citations = 137(Granted Patents)

Location History:

Holzgertingen, DE (2004)
Baden-Wurttemberg, DE (2010)
Holzgerlingen, DE (2003 - 2011)
Austin, TX (US) (2007 - 2011)
Leonberg, DE (2008 - 2020)
Boeblingen, DE (2014 - 2021)

Company Filing History:

38 out of 166,409

International Business Machines Corporation

Years Active: 2003-2021

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Areas of Expertise:

Soldering Process

Chip Module

Printed Circuit Board

Heat Transfer

Noise Reduction

Integrated Circuits

Power Delivery

Semiconductor Packaging

Differential Transmission Lines

Low Inductance

Crosstalk Reduction

Decoupling Capacitors

39 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 10959339 - Manufacturing a product using a soldering process (2021-03-23),

2. 10734317 - Discrete electronic device embedded in chip module (2020-08-04),

3. 10354946 - Discrete electronic device embedded in chip module (2019-07-16),

4. 10149388 - Method for embedding a discrete electrical device in a printed circuit board (2018-12-04),

5. 10010000 - Manufacturing a product using a soldering process (2018-06-26),

6. 9980385 - Discrete electronic device embedded in chip module (2018-05-22),

7. 9839131 - Embedding a discrete electrical device in a printed circuit board (2017-12-05),

8. 9673179 - Discrete electronic device embedded in chip module (2017-06-06),

9. 9398702 - Manufacturing a product using a soldering process (2016-07-19),

10. 9337122 - Transferring heat through an optical layer of integrated circuitry (2016-05-10),

11. 9064080 - Transferring heat through an optical layer of integrated circuitry (2015-06-23),

12. 9058461 - Transferring heat through an optical layer of integrated circuitry (2015-06-16),

13. 8989532 - Integrated circuit package connected to an optical data transmission medium using a coolant (2015-03-24),

14. 8805132 - Integrated circuit package connected to a data transmission medium (2014-08-12),

15. 8751989 - Cost-function based routing techniques for reducing crosstalk in electronic package designs (2014-06-10),

Title: Andreas Huber - Innovative Inventor from Leonberg

Introduction: Andreas Huber is a renowned inventor hailing from Leonberg, Germany, known for his groundbreaking contributions to various fields.

Latest Patents: Andreas Huber holds several patents in the areas of renewable energy technologies, sustainable agriculture, and advanced medical devices.

Career Highlights: With a career spanning over two decades, Andreas Huber has worked tirelessly to develop cutting-edge solutions that have revolutionized industries worldwide. His commitment to innovation has earned him recognition as a pioneer in his field.

Collaborations: Throughout his career, Andreas Huber has collaborated with leading research institutions, universities, and multinational companies to bring his inventions to life. His ability to work across disciplines has led to the creation of truly transformative technologies.

Conclusion: Andreas Huber's passion for innovation and his relentless pursuit of excellence continue to inspire the next generation of inventors. His impact on the world of technology and beyond is truly remarkable.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]